公开(公告)号：EP3379906A1

公开(公告)日：2018-09-26

申请号：EP18155960.0

申请日：2018-02-09

Applicant: ZKW Group GmbH

Inventor： Edlinger, Erik ,  Dragosits, Bernd ,  Führinger, Roman

IPC: H05K3/32 ,  H05K3/36 ,  H01L23/49 ,  H05K3/40 ,  H05K3/22 ,  H01R12/57 ,  H01R4/48

CPC classification number: H05K3/366 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48998 ,  H05K1/117 ,  H05K3/222 ,  H05K2201/0939 ,  H05K2201/10287 ,  H05K2201/10363 ,  H01L2924/00014

Abstract: Ein elektronisches Bauteil (1) mit elektrischen Anschlussstellen (5o, 5u), bei welchem ein zumindest Bonddraht (4) von zumindest einer ersten Anschlussstelle (5o) über die Bauteiloberfläche zu zumindest einer zweiten Anschlussstelle (5u) geführt ist, wobei an der zumindest ersten und an der zumindest zweiten Anschlussstelle eine Bondverbindung des Drahtes mit einer Kontaktfläche der Anschlussstelle hergestellt ist, wobei auf dem Bauteil (1) zumindest eine Abstützung (6) für den zumindest einen Bonddraht (4) vorgesehen ist und zumindest ein Bonddraht zwischen einer ersten Anschlussstelle (5o) und einer zweiten Anschlussstelle (5u) von der Abstützung in einem vorgegeben Abstand von Oberflächenabschnitten des Bauteils gehalten ist, und ein Verfahren zur Herstellung eines solchen Bauteils, bei welchem vor dem Führen des Bonddrahtes (4) von einer ersten (5o) zu einer zweiten (5u) Anschlussstelle auf dem Bauteil (1) zumindest eine Abstützung (6) für den Bonddraht errichtet wird, welche den Bonddraht in einem vorgegeben Abstand von Oberflächenabschnitten des Bauteils hält.

公开(公告)号：EP2328265A4

公开(公告)日：2018-03-07

申请号：EP09814318

申请日：2009-09-17

Applicant: MITSUBISHI HEAVY IND LTD

Inventor： TESHIMA KAZUNORI ,  TOYAMA KOJI ,  NAKANO KOJI ,  SATO HIDETAKA

IPC: H02M7/48 ,  H01L25/07 ,  H01L25/18 ,  H05K3/28 ,  H05K5/06 ,  H05K7/14

CPC classification number: H05K7/1432 ,  H05K1/144 ,  H05K3/284 ,  H05K5/064 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1476

Abstract: There is provided an inverter device that is small in size and has high durability against long-term use with vibration. A power substrate 20 is placed at a bottom portion of a box-shaped module case 11, and a control substrate 30 forms a lid of an opening in the module case 11, and thus an inverter device 10 of the present invention is modularized, thereby reducing a height of the inverter device 10. In the inverter device 10, a capacitor 22 is provided between the power substrate 20 and the control substrate 30, and the capacitor 22 is covered with a resin mold layer 12 and fixed in the module case 11. The capacitor 22 is fixed in the module case 11 by the resin mold layer 12, which provides higher durability against vibration than that by conventional fastening with a screw.

公开(公告)号：EP3285555A1

公开(公告)日：2018-02-21

申请号：EP17161179.1

申请日：2017-03-15

Applicant: Delta Electronics Inc.

Inventor： KU, Chen-Wei ,  LIN, Yao-Chien ,  LIN, Xin-Hung

IPC: H05K1/18 ,  H05K3/32 ,  H01R9/18 ,  H01R12/70

CPC classification number: H01R12/7076 ,  H01R9/18 ,  H01R13/6215 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K3/325 ,  H05K7/1427 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: An electrical connection of an electronic component 30, such as an inductor, and a circuit board 20 is implemented as follows. The circuit board has a through-hole 21 and is located at a distance from an inner bottom surface 101 of a case 10. The electronic component is disposed around the through-hole and between the inner bottom surface and the circuit board. The electronic component has a conducting wire 31 and a conducting plate 32. A conductive connector 40 is disposed between the through-hole and the conducting plate and electrically connected to the conducting plate. The electronic component is electrically connected to the circuit board through the conductive connector. A insulated connector 50 corresponds to the conductive connector and is located between the conducting plate and the inner bottom surface. A fastener 60 is connected to the conductive connector through the through-hole. Thus, a good electrical connection between the electronic component and the circuit board is achieved.

Abstract translation: 诸如电感器和电路板20的电子部件30的电连接如下实现。 电路板具有通孔21并且与壳体10的内底面101隔开一段距离。电子元件设置在通孔周围以及内底面和电路板之间。 电子元件具有导线31和导电板32.导电连接器40设置在通孔和导电板之间并电连接到导电板。 电子组件通过导电连接器电连接到电路板。 绝缘连接器50对应于导电连接器并位于导电板和内底面之间。 紧固件60通过通孔连接到导电连接器。 因此，实现了电子元件和电路板之间的良好电连接。

公开(公告)号：EP3251148A1

公开(公告)日：2017-12-06

申请号：EP15880378.3

申请日：2015-01-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： ALCORN, Byron A. ,  WARD, Shane ,  SEILER, Peter Andrew

IPC: H01L23/14 ,  H05K3/34

CPC classification number: H01R12/778 ,  G06F1/185 ,  H01R12/7047 ,  H01R12/79 ,  H01R13/35 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K7/142 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/2036

Abstract: An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

公开(公告)号：EP3222124A1

公开(公告)日：2017-09-27

申请号：EP15795302.7

申请日：2015-11-05

Applicant: TE Connectivity Corporation

Inventor： SHOCKET, Abraham Louis ,  BRYAN, Lyle Stanley ,  COWAN, John Steven ,  PETERSON, Kevin John

IPC: H05K1/02 ,  H01R12/00 ,  H05K7/20

CPC classification number: H05K1/181 ,  H01R12/515 ,  H05K1/0203 ,  H05K5/0069 ,  H05K7/20854 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10537

Abstract: An electrical assembly (200) configured to be fixed in a housing of an electrical connector includes an electrical package (204) disposed on a substrate (202) and electrically connected to the substrate. The electrical assembly also includes a conductor (211) terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment (218) of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package.

Abstract translation: 被配置成固定在电连接器的外壳中的电组件包括设置在基板上并电连接到基板的电封装。 该电气组件还包括在与电气封装间隔开的位置处终止于衬底的导体，以向衬底提供功率或控制信号中的至少一个。 导体的端接段被热耦合至电封装以接收在电封装处产生的热量并且通过导体散发热量远离电封装。

公开(公告)号：EP3195707A1

公开(公告)日：2017-07-26

申请号：EP14758210.0

申请日：2014-08-12

Applicant: Advanced Bionics AG

Inventor： LI, Lin ,  XIE, Jian ,  WALTER, Jeryle

IPC: H05K3/32 ,  H01R4/02

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

Abstract translation: 将导线（126）连接到馈通引脚（104）和包括连接到馈通引脚的导线的装置的方法。

公开(公告)号：EP3163984A1

公开(公告)日：2017-05-03

申请号：EP16195933

申请日：2016-10-27

Applicant: TYCO ELECTRONICS (DONGGUAN) LTD ,  TYCO ELECTRONICS (SHANGHAI) CO LTD ,  SHENZHEN AMI TECH CO LTD ,  TE CONNECTIVITY GERMANY GMBH

Inventor： SHEN HONGZHOU ,  ZHANG DANDAN ,  ZENG QINGLONG ,  LU ROBERTO FRANCISCO-YI ,  DUBNICZKI GEORGE

IPC: H05K1/11 ,  C25D5/50 ,  H05K3/34

CPC classification number: H05K3/403 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/08 ,  H05K1/117 ,  H05K3/101 ,  H05K3/3405 ,  H05K2201/09381 ,  H05K2201/09745 ,  H05K2201/10287 ,  H05K2203/0165 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0392 ,  H05K2203/1105 ,  H05K2203/16

Abstract: The present disclosure discloses pre-tin system shaping system and method. The pre-tin shaping system is adapted to shape a pre-tin on a pad (5) of a circuit board (4). The pre-tin shaping system includes: a board holding unit (2) for securely holding the circuit board; a heat-press unit (1) for performing a heat-press operation to the pre-tin on the pad of the circuit board so as to shape the pre-tin; and a motion unit (3) for moving the heat-press unit relative to the board holding unit; wherein the heat-press unit includes a heat presser (10) for shaping the pre-tin on the pad of the circuit board. With the pre-tin system shaping system and method provided herein, by performing a shaping operation to the pre-tin on the pad of the circuit board, position of an electrical contact on the pad of the circuit board during soldering will be precisely controlled, thereby guaranteeing soldering quality and reducing a risk of dry joint or faulty joint and the like.

Abstract translation: 本公开公开了预锡系统整形系统和方法。 预锡成形系统适于在电路板（4）的衬垫（5）上成形预锡。 预锡成形系统包括：用于牢固地保持电路板的板保持单元（2） 热压单元（1），用于对电路板的焊盘上的预锡进行热压操作以对预锡进行成形; 和用于相对于所述板保持单元移动所述热压单元的运动单元（3） 其中所述热压单元包括用于在所述电路板的所述焊盘上成形所述预锡的热压器（10）。 利用此处提供的预锡系统成形系统和方法，通过对电路板的焊盘上的预锡执行成形操作，焊接期间电接触垫在电路板的焊盘上的位置将被精确控制， 从而保证了焊接质量并降低了干接点或有缺陷的接点等的风险。

公开(公告)号：EP3128820A2

公开(公告)日：2017-02-08

申请号：EP16182401.6

申请日：2016-08-02

Applicant: Goodrich Corporation

Inventor： ABBOTT, Michael ,  SLANKER, Andrew ,  SYVERSON, Brian ,  REED, Eric Joseph ,  DURKEE, Scott R. ,  WHITE, Alexander

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H01R13/58 ,  H01R12/7076 ,  H01R43/205 ,  H05K1/0257 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/116 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A circuit card (1, 9) is disclosed. The circuit card (1, 9) may have a strain relief aperture (22-1 ... 22-7) and a conductor contact. A conductor (3) may extend through the strain relief aperture (22-1) and connect in electrical continuity with the conductor contact. The circuit card (1, 9) may have a conformal coating, such as poly(p-xylylene) polymer applied. The conformal coating may be applied in layers, and the layers may have different thicknesses.

Abstract translation: 公开了一种电路卡（1,9）。 电路卡（1,9）可具有应变消除孔（22-1 ... 22-7）和导体触点。 导体（3）可以延伸穿过应变消除孔（22-1）并且与导体触点电连续地连接。 电路卡（1,9）可以具有保形涂层，例如所应用的聚（对二甲苯）聚合物。 保形涂层可以分层施加，并且这些层可以具有不同的厚度。

公开(公告)号：EP1574044B1

公开(公告)日：2017-01-11

申请号：EP03778331.3

申请日：2003-11-21

Applicant: Continental Automotive GmbH

Inventor： BELAU, Horst

IPC: H04N5/225 ,  H05K1/14

CPC classification number: H04N5/2252 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H04N5/2251 ,  H05K1/0206 ,  H05K1/141 ,  H05K1/142 ,  H05K1/148 ,  H05K3/0061 ,  H05K2201/10287 ,  H05K2203/302 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP3079448A2

公开(公告)日：2016-10-12

申请号：EP16162836.7

申请日：2016-03-30

Applicant: Hamilton Sundstrand Corporation

Inventor： COONEY, Robert C. ,  DICKEY, John A. ,  MILLER, Christian ,  FRITZ, Kevin Case

IPC: H05K3/32 ,  H05K5/00

CPC classification number: H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: A circuit board (22) has a socket (24) with at least one plated through-hole (26). A connector (28) includes a housing (36) that has first and second connector interfaces (30,32) with, respectively, at least first and second connector contacts (34). The first connector interface (30) opens into an interior of the housing (36) such that there is a vapor path (38) through the first connector interface (30) and the interior of the housing (36) to the second connector contact (34) at the second connector interface (32). A resilient seal (40) is located at the first connector interface (30). The first connector contact (34) extends through the resilient seal (40) and into the plated through-hole (26). The resilient seal (40) intimately seals around the first connector contact (34) and provides a barrier at the first connector interface (30) into the vapor path (38).

Abstract translation: 电路板（22）具有带有至少一个镀通孔（26）的插座（24）。 连接器（28）包括具有分别具有至少第一和第二连接器触点（34）的第一和第二连接器接口（30,32）的壳体（36）。 第一连接器接口（30）通向壳体（36）的内部，使得存在穿过第一连接器接口（30）并且壳体（36）的内部到达第二连接器触头（30）的蒸气路径（38） 在第二连接器接口（32）处。 弹性密封件（40）位于第一连接器接口（30）处。 第一连接器触点（34）延伸穿过弹性密封件（40）并进入镀通孔（26）。 弹性密封件（40）围绕第一连接器触头（34）紧密密封并且在第一连接器接口（30）处提供进入蒸气路径（38）的阻挡件。