Semiconductor device and method of manufacturing the same
    3.
    发明公开
    Semiconductor device and method of manufacturing the same 有权
    半导体器件及其制造方法

    公开(公告)号:EP2908349A1

    公开(公告)日:2015-08-19

    申请号:EP15153086.2

    申请日:2015-01-29

    摘要: A semiconductor device of an embodiment includes a p-type first diamond semiconductor layer, a p-type second diamond semiconductor layer disposed on the first diamond semiconductor layer, a plurality of n-type third diamond semiconductor layers disposed on the second diamond semiconductor layer, and a first electrode disposed on the second diamond semiconductor and the third diamond semiconductor layers. The p-type second diamond semiconductor layer has a p-type impurity concentration lower than a p-type impurity concentration of the first diamond semiconductor layer and has oxygen-terminated surfaces. Each of the third diamond semiconductor layers has an oxygen-terminated surface. The first electrode forms first junctions between the first electrode and the second diamond semiconductor. The first electrode forms second junctions between the first electrode and the third diamond semiconductor layers. The first junctions and the second junctions are Schottky junctions.

    摘要翻译: 本发明实施例的半导体器件包括p型第一金刚石半导体层,设置在第一金刚石半导体层上的p型第二金刚石半导体层,设置在第二金刚石半导体层上的多个n型第三金刚石半导体层, 以及设置在第二金刚石半导体和第三金刚石半导体层上的第一电极。 p型第二金刚石半导体层具有比第一金刚石半导体层的p型杂质浓度低的p型杂质浓度,并且具有氧终止表面。 每个第三金刚石半导体层具有氧终止表面。 第一电极形成第一电极和第二金刚石半导体之间的第一结。 第一电极在第一电极和第三金刚石半导体层之间形成第二结。 第一个路口和第二个路口是肖特基接头。