Organic EL device and liquid crystal display with Peltier element
    1.
    发明公开
    Organic EL device and liquid crystal display with Peltier element 审中-公开
    有机化学成分和有机化合物

    公开(公告)号:EP1463129A2

    公开(公告)日:2004-09-29

    申请号:EP04007129.2

    申请日:2004-03-24

    摘要: A liquid crystal display including a liquid crystal panel and an organic EL device, which functions as a backlight. The organic EL device includes a Peltier element, which functions as a substrate, and an organic EL element formed on the Peltier element. The organic EL element includes an organic EL layer and first and second electrodes, which sandwich the organic EL layer. The first electrode is shared with a metal layer, which is a heat absorbing electrode of the Peltier element. The second electrode is formed from ITO, which transmits visible light. Light emitted from the organic EL element exits from the second electrode. As a result, the organic EL device is thin and has a superior cooling effect.

    摘要翻译: 一种液晶显示器,包括用作背光源的液晶面板和有机EL器件。 有机EL器件包括用作衬底的珀尔帖元件和形成在珀尔帖元件上的有机EL元件。 有机EL元件包括有机EL层和夹着有机EL层的第一和第二电极。 第一电极与作为珀耳帖元件的吸热电极的金属层共享。 第二电极由透过可见光的ITO形成。 从有机EL元件发射的光从第二电极排出。 结果,有机EL元件薄且具有优异的冷却效果。

    MASK MAKING METHOD, MASK MAKING DEVICE, AND MASK DRAWING DEVICE
    4.
    发明公开
    MASK MAKING METHOD, MASK MAKING DEVICE, AND MASK DRAWING DEVICE 审中-公开
    方法和装置口罩蒙版绘制生产和考虑器件

    公开(公告)号:EP1602974A1

    公开(公告)日:2005-12-07

    申请号:EP04705928.2

    申请日:2004-01-28

    IPC分类号: G03F1/08 G03F7/20 H01L21/027

    CPC分类号: G03F7/70283 G03F7/70291

    摘要: Laser light in a pattern reflected by a two-dimensional array micromirror 106 that is controlled on the basis of mask data of a mask pattern data output device 107 forms an enlarged pattern 110. This enlarged pattern is projected in a reduced manner onto a mask substrate 109 through a reduction-projection optical system 102, thereby forming a lithography pattern 111. Since a large number of patterns are written in an instant by the two-dimensional array micromirror 106, a time required for lithography the entire mask pattern is extremely shortened as compared with a conventional one. As a result, the mask cost can be largely reduced.

    摘要翻译: 在由二维阵列微镜106反射的图案的激光也被掩模图案数据输出装置107种形式的放大图案110的该放大的图案以缩小的方式投射的掩模数据的基础上,到掩模衬底控制 109通过一个缩小投影光学系统102,由此形成光刻图案111由于大量的模式由二维阵列微镜106写入到瞬间,光刻所需要的时间将整个掩模图案被大大地缩短为 与以往相比。 其结果,掩模成本能够大大降低。

    Semiconductor device and method of manufacturing the same
    5.
    发明公开
    Semiconductor device and method of manufacturing the same 审中-公开
    半导体装置及它们的制备方法

    公开(公告)号:EP1427003A3

    公开(公告)日:2005-03-02

    申请号:EP03027739.6

    申请日:2003-12-02

    申请人: OHMI, Tadahiro

    IPC分类号: H01L21/306 H01L21/336

    摘要: In a semiconductor device formed on a silicon surface which has a substantial (110) crystal plane orientation, the silicon surface is flattened so that an arithmetical mean deviation of surface Ra is not greater than 0.15nm, preferably, 0.09nm, which enables to manufacture an n-MOS transistor of a high mobility. Such a flattened silicon surface is obtained by repeating a deposition process of a self-sacrifice oxide film in an oxygen radical atmosphere and a removing process of the self-sacrifice oxide film, by cleaning the silicon surface in deaerated H 2 O or a low OH density atmosphere, or by strongly terminating the silicon surface by hydrogen or heavy hydrogen. The deposition process of the self-sacrifice oxide film may be carried out by isotropic oxidation.

    Semiconductor device and method of manufacturing the same
    6.
    发明公开
    Semiconductor device and method of manufacturing the same 审中-公开
    半导体器件及其制造方法

    公开(公告)号:EP1427003A2

    公开(公告)日:2004-06-09

    申请号:EP03027739.6

    申请日:2003-12-02

    申请人: OHMI, Tadahiro

    IPC分类号: H01L21/306 H01L21/336

    摘要: In a semiconductor device formed on a silicon surface which has a substantial (110) crystal plane orientation, the silicon surface is flattened so that an arithmetical mean deviation of surface Ra is not greater than 0.15nm, preferably, 0.09nm, which enables to manufacture an n-MOS transistor of a high mobility. Such a flattened silicon surface is obtained by repeating a deposition process of a self-sacrifice oxide film in an oxygen radical atmosphere and a removing process of the self-sacrifice oxide film, by cleaning the silicon surface in deaerated H 2 O or a low OH density atmosphere, or by strongly terminating the silicon surface by hydrogen or heavy hydrogen. The deposition process of the self-sacrifice oxide film may be carried out by isotropic oxidation.

    摘要翻译: 在形成于具有实质上(110)晶面取向的硅表面上的半导体器件中,硅表面被平坦化,使得表面Ra的算术平均偏差不大于0.15nm,优选为0.09nm,这能够制造 高迁移率的n-MOS晶体管。 通过重复在氧自由基气氛中的自牺牲氧化物膜的沉积过程和自牺牲氧化物膜的去除过程,通过在脱气的H 2 O或低OH密度气氛中清洁硅表面来获得这种平坦的硅表面 或者通过氢或重氢强烈地终止硅表面。 自牺牲氧化物膜的沉积过程可以通过各向同性氧化进行。