公开(公告)号：EP1193280B1

公开(公告)日：2004-11-24

申请号：EP00913104.6

申请日：2000-04-04

申请人： Kaneka Corporation

发明人： Tsuji, Hiroyuki ,  Furutani, Hiroyuki ,  Tanaka, Koichiro ,  Kikuchi, Takeshi

IPC分类号： C08G73/10 ,  C08L79/08 ,  C08L63/00 ,  C09J179/08 ,  C09J7/02

CPC分类号： C08G73/1064 ,  C08G73/10 ,  C08G73/101 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/14 ,  C09J7/10 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J2463/00 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K3/386 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): wherein X represents -(CH2)k-, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.

公开(公告)号：EP1193280A1

公开(公告)日：2002-04-03

申请号：EP00913104.6

申请日：2000-04-04

申请人： Kaneka Corporation

发明人： Tsuji, Hiroyuki ,  Furutani, Hiroyuki ,  Tanaka, Koichiro ,  Kikuchi, Takeshi

IPC分类号： C08G73/10 ,  C08L79/08 ,  C08L63/00 ,  C09J179/08 ,  C09J7/02

CPC分类号： C08G73/1064 ,  C08G73/10 ,  C08G73/101 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/14 ,  C09J7/10 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J2463/00 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K3/386 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1):
wherein X represents -(CH 2 ) k -, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.

摘要翻译： 本发明提供一种聚酰亚胺树脂，树脂组合物中，粘合剂溶液，膜态结合部件的附着力，并粘合性层压薄膜的水溶性在具有优异的耐热性的溶剂，并能够粘结，并在相对低的温度固化。 具体而言，本发明提供一种新的聚酰亚胺树脂具有由含有由通式（1）表示的酯酸二酐的四羧酸二酐之间的反应得到的低吸水率： worin X darstellt - （CH 2）K，或 是该方法包括对芳族环，和k是从1到10的整数的二价基团; 和芳族二胺，其中，所述树脂组合物和薄膜状结合部件，其包含与用该树脂密合性优异的热固性树脂优选地用于柔性印刷电路板，用于TAB层压带（带自动键合），复合的引线框，和 材料，或类似物，以及粘合性层压薄膜，适合于超导线材的涂层。