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公开(公告)号:EP1542789A1
公开(公告)日:2005-06-22
申请号:EP03765783.0
申请日:2003-07-18
申请人: Kinetic Systems Inc.
CPC分类号: G05D11/132 , B01F3/0092 , B01F3/04985 , B01F3/088 , B01F3/1271 , B01F3/188 , B01F15/0408 , G05D11/138
摘要: A method and apparatus for blending and supplying process materials. The method and apparatus are particularly applicable to the blending of ultra-high purity chemicals, the blending of abrasive slurries with other chemicals for the polishing of semiconductor wafers, and high-accuracy blending of chemicals.
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公开(公告)号:EP1542789B1
公开(公告)日:2006-11-29
申请号:EP03765783.0
申请日:2003-07-18
申请人: Kinetic Systems Inc.
CPC分类号: G05D11/132 , B01F3/0092 , B01F3/04985 , B01F3/088 , B01F3/1271 , B01F3/188 , B01F15/0408 , G05D11/138
摘要: A method and apparatus for blending and supplying process materials. The method and apparatus are particularly applicable to the blending of ultra-high purity chemicals, the blending of abrasive slurries with other chemicals for the polishing of semiconductor wafers, and high-accuracy blending of chemicals.
摘要翻译: 混合和供应工艺材料的方法和设备。 该方法和设备特别适用于超高纯度化学品的混合,研磨浆与其他化学品的混合以抛光半导体晶片,以及化学品的高精度混合。
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