-
公开(公告)号：EP4383082A1
公开(公告)日：2024-06-12
申请号：EP21956010.9
申请日：2021-09-02
申请人： Kioxia Corporation
发明人： HITOMI, Tatsuro , YOSHIMIZU, Yasuhito , MIURA, Masayuki , MIYAOKA, Mitoshi , KOJIMA, Tetsuharu , SANUKI, Tomoya
摘要： A storage system useful for processing large amounts of data is provided.
A package stocker is configured to store a plurality of semiconductor packages each including one or more nonvolatile memory dies. A drive includes at least one socket on which a semiconductor package is able to be detachably mounted. A host apparatus, which is communicatively connected to the drive, reads/writes data from/to the one or more nonvolatile memory dies of the semiconductor package via the controller. When a first semiconductor package is not mounted on the socket, the host apparatus causes a package transport device to transport the first semiconductor package to the socket of the drive and to mount the first semiconductor package on the socket.-
公开(公告)号：EP4307342A1
公开(公告)日：2024-01-17
申请号：EP21930041.5
申请日：2021-03-08
申请人： Kioxia Corporation
发明人： HITOMI, Tatsuro , YOSHIMIZU, Yasuhito , MIURA, Masayuki , INOUE, Arata , DOHMAE, Hiroyuki , NAKAZAWA, Koichi , MIYAOKA, Mitoshi , HAYASAKA, Kazuhito , SANUKI, Tomoya
摘要： According to one embodiment, a wafer (10) includes a substrate (11) including a first region (RA) and a second region (RB) that do not overlap each other; a first chip unit and a second chip unit (100) each arranged on the substrate; a first electrode (16A) and a second electrode (16B) each electrically connected to the first chip unit; and a third electrode (16A) and a fourth electrode (16B) each electrically connected to the second chip unit. The first electrode and the third electrode are arranged in the first region. The second electrode and the fourth electrode are arranged in the second region. The first region is independent of a region in which the first chip unit and the second chip unit are provided.
-
搜索结果
2 条记录 (耗时 0.007 秒)
