BACK-ILLUMINATED SENSOR WITH BORON LAYER
    1.
    发明公开
    BACK-ILLUMINATED SENSOR WITH BORON LAYER 有权
    带有硼层的背照式传感器

    公开(公告)号:EP2837031A1

    公开(公告)日:2015-02-18

    申请号:EP13775490.9

    申请日:2013-04-08

    IPC分类号: H01L27/148 H01L27/146

    摘要: An image sensor for short-wavelength light and charged particles includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.

    摘要翻译: 用于短波长光和带电粒子的图像传感器包括半导体膜,在半导体膜的一个表面上形成的电路元件以及在半导体膜的另一个表面上的纯硼层。 该图像传感器即使在多年的高通量连续使用下也具有高效率和高稳定性。 图像传感器可以使用CCD(电荷耦合器件)或CMOS(互补金属氧化物半导体)技术制造。 图像传感器可以是二维区域传感器或一维阵列传感器。 图像传感器可以包含在电子轰击图像传感器和/或检查系统中。

    BACK-ILLUMINATED SENSOR WITH BORON LAYER
    2.
    发明授权
    BACK-ILLUMINATED SENSOR WITH BORON LAYER 有权
    RÜCKBELEUCHTETER传感器麻省理工学院

    公开(公告)号:EP2837031B1

    公开(公告)日:2017-06-07

    申请号:EP13775490.9

    申请日:2013-04-08

    摘要: An image sensor for short-wavelength light and charged particles includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.

    摘要翻译: 用于短波长光和带电粒子的图像传感器包括半导体膜,形成在半导体膜的一个表面上的电路元件和在半导体膜的另一个表面上的纯硼层。 该图像传感器具有高效率和良好的稳定性,即使在高通量下连续使用多年。 图像传感器可以使用CCD(电荷耦合器件)或CMOS(互补金属氧化物半导体)技术来制造。 图像传感器可以是二维区域传感器或一维阵列传感器。 图像传感器可以包括在电子轰击图像传感器和/或检查系统中。