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公开(公告)号：EP2901714A1
公开(公告)日：2015-08-05
申请号：EP13842019.5
申请日：2013-09-26
发明人： VOS, Sandra F. , GIESECKE, Daniel
CPC分类号： H04R19/04 , H01L2224/04105 , H01L2224/20 , H01L2224/24145 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2924/15151 , H04R1/04 , H04R19/005 , H04R31/00
摘要： A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The at least one output signal of the integrated circuit is routed directly into at least one conductor to access pads at the printed circuit board. The access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface. The integrated circuit includes conductive pads and an interface layer is disposed between the conductive pads of the integrated circuit and the printed circuit board.
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公开(公告)号：EP2883365A1
公开(公告)日：2015-06-17
申请号：EP13828121.7
申请日：2013-08-08
发明人： LOEPPERT, Peter V. , MCCALL, Ryan, M. , GIESECKE, Daniel , VOS, Sandra F. , SZCZECH, John B. , LEE, Sung Bok , VAN KESSEL, Peter
CPC分类号： H04R1/08 , H04R1/04 , H04R1/086 , H04R2201/003
摘要： A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.
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