Heat-sensitive lithographic printing plate precursor
    1.
    发明公开
    Heat-sensitive lithographic printing plate precursor 审中-公开
    热敏平版印刷版前体

    公开(公告)号:EP1449675A1

    公开(公告)日:2004-08-25

    申请号:EP04003616.2

    申请日:2004-02-18

    IPC分类号: B41M5/36 B41C1/10

    摘要: Heat-sensitive element, comprising

    (a) an optionally pretreated substrate
    (b) a positive working heat-sensitive coating, comprising at least one phenolic resin and at least one inhibitor polymer selected from

    (i) polymers comprising saturated (hetero)cyclic moieties with at least one carbonyl group, the carbon atom of which is part of the (hetero)cyclic moiety, said (hetero)cyclic moieties being bonded to a polymer chain directly
    (ii) polymers comprising unsaturated heterocyclic moieties which are bonded to a polymer chain directly and which have a ring nitrogen atom, said ring nitrogen atom being bonded to the two adjacent ring carbon atoms via a single bond and a double bond and moreover having a free electron pair, and
    (iii) copolymers comprising both saturated (hetero)cyclic moieties as defined in (i) and unsaturated heterocyclic moieties as defined in (ii).

    摘要翻译: (a)任选预处理的基材(b)正性热敏涂层,其包含至少一种酚醛树脂和至少一种抑制剂聚合物,所述抑制剂聚合物选自(i)包含饱和(杂)环部分的聚合物与 至少一个羰基,其碳原子是(杂)环部分的一部分,所述(杂)环部分直接键合到聚合物链上;(ii)包含直接键合到聚合物链上的不饱和杂环部分的聚合物 并且其具有环氮原子,所述环氮原子通过单键和双键与两个相邻的环碳原子键合,并且还具有自由电子对,和(iii)包含饱和(杂)环状部分 如(i)中所定义的和(ii)中定义的不饱和杂环部分。