公开(公告)号：EP2728991B1

公开(公告)日：2020-04-22

申请号：EP13191757.7

申请日：2013-11-06

申请人： Koh Young Technology Inc.

发明人： Lee, Seung-Jun ,  Jeon, Moon-Young ,  Lee, Nam-Ho

IPC分类号： H05K13/08 ,  G05B19/418

公开(公告)号：EP2728991A3

公开(公告)日：2017-07-26

申请号：EP13191757.7

申请日：2013-11-06

申请人： Koh Young Technology Inc.

发明人： Lee, Seung-Jun ,  Jeon, Moon-Young ,  Lee, Nam-Ho

IPC分类号： H05K13/08 ,  G05B19/418

摘要： A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.

摘要翻译： 电路板检查设备系统包括第一设备，第二设备，第三设备和信息传送部分。 第一装置获取板上的焊膏的第一三维信息，并且基于第一三维信息检查焊膏是否以第一公差形成良好。 第二装置在电路板上安装电子元件以接合电子元件和焊膏。 第三装置获取焊点的第二三维信息，并且基于第二三维信息检查电子元件是否以第二公差良好地安装。 信息传送部分将第一三维信息传送到第三装置，或将第二三维信息传送到第一装置。 因此，可以建立更有效的检查条件，并且可以大大降低每个装置的缺陷率。

公开(公告)号：EP2728991A2

公开(公告)日：2014-05-07

申请号：EP13191757.7

申请日：2013-11-06

申请人： Koh Young Technology Inc.

发明人： Lee, Seung-Jun ,  Jeon, Moon-Young ,  Lee, Nam-Ho

IPC分类号： H05K13/08

摘要： A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.

摘要翻译： 板检查装置系统包括第一装置，第二装置，第三装置和信息传送部。 第一装置获取板上的焊膏的第一三维信息，并基于第一三维信息检查焊膏是否形成良好的第一公差。 第二装置将电子部件安装在板上以连接电子部件和焊膏。 第三装置获取焊点的第二三维信息，并且基于第二三维信息来检查电子部件是否良好地被安装良好的第二公差。 信息传送部分将第一三维信息传送到第三装置，或将第二三维信息传送到第一装置。 因此，可以建立更有效的检查条件，并且可以大大降低每个装置的缺陷率。