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公开(公告)号：EP2981413A1
公开(公告)日：2016-02-10
申请号：EP14778211.4
申请日：2014-03-31
发明人： WOO, Hak Yong , JUNG, Hak Gee , HONG, Ki ll
摘要： Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
摘要翻译： 本发明公开了一种聚酰亚胺覆盖基板，该聚酰亚胺覆盖基板被构造成使得在聚酰亚胺膜的至少一侧上由聚氨酯丙烯酸酯化合物形成器件保护层，由此不仅表现出高弯曲性能和抗冲击性，而且还表现出优异的耐溶剂性，光学 性能和耐刮擦性以及低水蒸气透过率，因此可以有效地用作柔性电子装置的覆盖基板。
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公开(公告)号：EP2981413B1
公开(公告)日：2019-11-13
申请号：EP14778211.4
申请日：2014-03-31
发明人： WOO, Hak Yong , JUNG, Hak Gee , HONG, Ki ll
IPC分类号： B32B27/08 , B32B27/34 , B32B9/00 , C09D133/14 , C08L83/04
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公开(公告)号：EP3241875B1
公开(公告)日：2020-03-25
申请号：EP15875770.8
申请日：2015-12-31
发明人： AHN, Sang Hyun , WOO, Hak Yong , JUNG, Hak Gee , LEE, Dong Hee , AN, Byung Joon , KIM, Hang Geun
IPC分类号： C09D183/14 , C09D163/00 , C09D133/00 , C08J5/18
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4.发明公开RESIN COMPOSITION FOR HARD COATING, AND HARD-COATING FILM COMPRISING CURED FORM OF SAME AS COATING LAYER 审中-公开用于硬涂层的树脂组合物以及包含固化层作为涂层的硬涂膜
公开(公告)号：EP3241875A1
公开(公告)日：2017-11-08
申请号：EP15875770.8
申请日：2015-12-31
发明人： AHN, Sang Hyun , WOO, Hak Yong , JUNG, Hak Gee , LEE, Dong Hee , AN, Byung Joon , KIM, Hang Geun
IPC分类号： C09D183/06 , C09D163/00 , C09D133/00 , C08J5/18
摘要： This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.
摘要翻译： 本发明涉及一种用于硬涂层的树脂组合物，其包括硅氧烷树脂和含有使用该树脂组合物形成的硬涂层的硬涂膜，所述硅氧烷树脂被配置为使得包含烷氧基硅烷和烷氧基金属化合物的化合物发生化学键合。
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公开(公告)号：EP2931795A1
公开(公告)日：2015-10-21
申请号：EP13861580.2
申请日：2013-12-10
发明人： WOO, Hak Yong , JUNG, Hak Gee , PARK, Hyo Jun
IPC分类号： C08J7/04 , C08J5/18 , C09D175/00 , G02B1/10
CPC分类号： C08J7/045 , B05D3/067 , C08G18/8025 , C08J7/047 , C08J7/08 , C08J2379/08 , C08J2451/08 , C08J2475/14 , C09D175/00 , C09D175/04 , G02B1/10 , Y10T428/265 , Y10T428/31562 , Y10T428/31598
摘要： The present invention provides a transparent polyimide substrate comprising a transparent polyimide film and a cured layer of a polyisocyanate formed on at least one surface of the transparent polyimide film, the polyisocyanate containing an acrylate group and having 2 to 5 isocyanate groups per molecule. The transparent polyimide substrate has excellent scratch resistance, solvent resistance, optical properties and flexibility and low water permeability and is useful as a cover substrate for a flexible electronic device.
摘要翻译： 本发明提供透明聚酰亚胺基材，其包含透明聚酰亚胺膜和在所述透明聚酰亚胺膜的至少一个表面上形成的聚异氰酸酯固化层，所述聚异氰酸酯含有丙烯酸酯基并且每个分子具有2至5个异氰酸酯基团。 透明聚酰亚胺基板具有优异的耐划伤性，耐溶剂性，光学特性和柔软性以及低透水性，并且可用作柔性电子装置的覆盖基板。
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