公开(公告)号：EP2689458B1

公开(公告)日：2018-01-10

申请号：EP12714374.1

申请日：2012-03-20

申请人： Koninklijke Philips N.V.

发明人： BASIN, Grigoriy ,  MARTIN, Paul, Scott

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

CPC分类号： H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2933/0091

摘要： LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs.

公开(公告)号：EP2831931A1

公开(公告)日：2015-02-04

申请号：EP13721402.9

申请日：2013-03-20

申请人： Koninklijke Philips N.V.

发明人： BASIN, Grigoriy ,  KUIPER, Stein ,  MARTIN, Paul, Scott

IPC分类号： H01L33/50 ,  C09K11/02

CPC分类号： H01L33/0095 ,  C09K11/02 ,  C09K11/08 ,  H01L33/005 ,  H01L33/501 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/10 ,  Y10T156/1062 ,  H01L2924/00012

摘要： A method for fabricating an LED/phosphor structure is described where an array of blue light emitting diode (LED) dies are mounted on a submount wafer. A phosphor powder is mixed with an organic polymer binder, such as an acrylate or nitrocellulose. The liquid or paste mixture is then deposited over the LED dies or other substrate as a substantially uniform layer. The organic binder is then removed by being burned away in air, or being subject to an O2 plasma process, or dissolved, leaving a porous layer of phosphor grains sintered together. The porous phosphor layer is impregnated with a sol-gel (e.g., a sol-gel of TEOS or MTMS) or liquid glass (e.g., sodium silicate or potassium silicate), also known as water glass, which saturates the porous structure. The structure is then heated to cure the inorganic glass binder, leaving a robust glass binder that resists yellowing, among other desirable properties.

摘要翻译： 描述了一种用于制造LED /荧光体结构的方法，其中将蓝色发光二极管（LED）裸片的阵列安装在底座晶片上。 将荧光体粉末与有机聚合物粘合剂如丙烯酸酯或硝化纤维素混合。 然后将液体或糊状混合物沉积在LED管芯或其它基底上，作为基本均匀的层。 然后通过在空气中燃烧或经历O 2等离子体处理或溶解而除去有机粘合剂，留下烧结在一起的多孔磷光体颗粒层。 多孔磷光体层用溶胶 - 凝胶（例如，TEOS或MTMS的溶胶 - 凝胶）或饱和多孔结构饱和的液体玻璃（例如硅酸钠或硅酸钾）（也称为水玻璃）浸渍。 然后将该结构加热以固化无机玻璃粘合剂，留下坚固的玻璃粘合剂，其耐受黄变以及其它所需的性能。

公开(公告)号：EP3276257A1

公开(公告)日：2018-01-31

申请号：EP17185946.5

申请日：2014-12-16

申请人： Koninklijke Philips N.V.

发明人： ELZINGA, Marcus, Johannes, Gerardus ,  MARTIN, Paul, Scott

IPC分类号： F21V29/00 ,  F21K99/00 ,  F21S8/10 ,  F21V7/00 ,  F21V23/00 ,  F21V23/06 ,  F21W101/10 ,  F21Y115/10 ,  F21Y111/00

CPC分类号： F21K9/235 ,  F21K9/23 ,  F21S41/147 ,  F21S41/192 ,  F21S41/321 ,  F21S41/36 ,  F21S41/37 ,  F21S41/47 ,  F21S45/40 ,  F21S45/47 ,  F21V7/00 ,  F21V23/003 ,  F21V23/06 ,  F21V29/87 ,  F21Y2101/00 ,  F21Y2111/00 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48247

摘要： An LED bulb includes a metal lead frame (96) on which is directly mounted a low beam set of first LED dies (14), a high beam set of second LED dies (16), and a high beam set of third LED dies (16). The lead frame (96) is bent so that the first LED dies (14) face upwards and the second and third LED dies (16) face sideways and in opposite directions. A thermally conductive opaque plastic body (98) is molded around the lead frame (96) and exposes the LED dies. The body (98) includes light-blocking features (26, 32, 36) to cause the light emission pattern of the first LED dies (14) to be limited in lateral and vertical directions for a low beam of a headlight. The light-blocking features (26, 32, 36) also cause the light emission pattern of the second and third LED dies (16) to be less limited in the lateral and vertical directions for a wider high beam of the headlight.

摘要翻译： 一种LED灯泡包括金属引线框架（96），在所述金属引线框架（96）上直接安装有近光灯组的第一LED晶粒（14），远光灯组的第二LED晶粒（16）以及远光灯组的第三LED晶粒 16）。 引线框架（96）弯曲，使得第一LED晶粒（14）面朝上，而第二和第三LED晶粒（16）侧向朝相反方向。 导热不透明塑料体（98）模制在引线框架（96）周围并暴露LED管芯。 主体（98）包括阻光特征（26,32,36），以使得第一LED管芯（14）的光发射图案在侧灯和垂直方向上被限制用于前灯的近光束。 挡光特征（26,32,36）还导致第二和第三LED管芯（16）的光发射图案在侧向和垂直方向上对前灯的较宽远光束的较小限制。

公开(公告)号：EP2810306A1

公开(公告)日：2014-12-10

申请号：EP13713504.2

申请日：2013-01-29

申请人： Koninklijke Philips N.V.

发明人： MARTIN, Paul, Scott ,  HNG, Tiang, Chuan ,  ISHIKAWA, Tomonari

IPC分类号： H01L33/00 ,  H01L33/22

CPC分类号： H01L33/58 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/22 ,  H01L2933/0058

摘要： Conventional techniques are used to control the flux of an LED element, by modifying a surface of a light emitting element. One type of modification is roughening the surface, to enhance the light extraction efficiency. The degree of modification of the surface is controlled by controlling one or more of the parameters associated with the modification process. A given LED technology will have some minimum flux without modification and some maximum flux with optimal modification. By characterizing the relationship between the parameters of the modifying process and the resultant flux, the parameters of the modification process can be controlled to achieve a desired flux between the minimum and maximum flux achievable by the given LED technology.

公开(公告)号：EP2689458A1

公开(公告)日：2014-01-29

申请号：EP12714374.1

申请日：2012-03-20

申请人： Koninklijke Philips N.V.

发明人： BASIN, Grigoriy ,  MARTIN, Paul, Scott

IPC分类号： H01L25/075 ,  H01L33/50

CPC分类号： H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2933/0091

摘要： LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs.

摘要翻译： LED芯片安装在单个底座瓦片（或晶片）上。 LED管芯具有发光顶表面。 然后将沉积有磷光体的均匀厚的紫外线敏感硅胶层沉积在瓦片上，包括在LED管芯的顶部和侧面。 仅需要在LED管芯的顶部和侧面上的硅氧烷/磷光体，因此需要去除直接在瓷砖上的硅氧烷/磷光体。 然后将硅氧烷/磷光体层掩蔽以暴露出保持为UV光的区域，这产生交联的硅氧烷。 然后将未曝光的硅氧烷/磷光体层用溶剂溶解并从瓷砖表面除去。 可以限定硅氧烷/磷光体层以暴露LED管芯上的引线接合电极。 瓦片最终被单独化以产生单个的磷光体转换的LED。