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1.
公开(公告)号:EP3640268A1
公开(公告)日:2020-04-22
申请号:EP19738507.3
申请日:2019-01-10
发明人: MORIWAKI, Yuya , ASADA, Kosuke , DONKAI, Masaru , TAKENAKA, Naomi
摘要: It is an object of the present invention to provide an unsaturated group-containing ester compound which can be used as a raw material of a curable composition using transesterification reaction and which is inexpensive and has a good curability, and a polymer, a thermosetting resin composition, and a curable composition which containing the unsaturated group-containing ester compound, respectively.
An unsaturated group-containing ester compound having a chemical structure represented by the following general formula (1).
n 1 : 1 to 10
(in the formula, R 1 , R 2 , and R 3 are the same or different and each is a hydrogen, an alkyl group, a carboxyl group, an alkyl ester group or a structure represented by R 4 -[COOR 5 ];
R 4 is an aliphatic, an alicyclic or an aromatic alkylene group with a number of atoms of 50 or less in the main chain, which may have one or more functional groups selected from the group consisting of an ester group, an ether group, an amide group, and a urethane and may have a side chain;
R 5 is an alkyl group having 50 or less carbon atoms; and in the compound represented by the general formula (1), the R 4 -[COOR 5 ] group may be a lactone structure represented by the following general formula (1-1).)
(R x is a hydrocarbon group having 2 to 10 carbon atoms which may have a branched chain.)-
公开(公告)号:EP4414426A1
公开(公告)日:2024-08-14
申请号:EP22890048.6
申请日:2022-11-07
发明人: MORIWAKI, Yuya , MATSUDA, Tomoya , ASADA, Kosuke , DONKAI, Masaru , NAKAGAWA, Hiroki , YOSHIDA, Narutoshi , TAKENAKA, Naomi
IPC分类号: C08L101/08 , C08K5/3445 , C08K5/56
CPC分类号: C08K5/3445 , C08L101/08 , C08K5/56
摘要: Provided is a curable resin composition having high reactivity and curable at low temperatures.
The curable resin composition includes: a resin component (A) having -COOR (R is an alkyl group having 50 or less carbon atoms) and a hydroxyl group; and a transesterification catalyst (B), characterized in that the transesterification catalyst (B) contains a zinc-containing compound and an imidazole compound.-
公开(公告)号:EP3623424A1
公开(公告)日:2020-03-18
申请号:EP18865015.4
申请日:2018-09-27
发明人: MORIWAKI, Yuya , ASADA, Kosuke , DONKAI, Masaru , TAKENAKA, Naomi
IPC分类号: C08L33/14 , C09D129/04 , C09D133/04 , C09D135/02 , C09J129/04 , C09J133/04 , C09J135/02
摘要: It is an object of the present invention to provide a thermosetting resin composition using a transesterification reaction as a curing reaction, which is inexpensive and has a good curability and can be used in various applications.
A thermosetting resin composition which comprises an ester compound having two or more alkyl ester groups in a molecule (A), a compound having two or more hydroxyl groups in a molecule (B), and a transesterification catalyst (C).-
公开(公告)号:EP4098696A1
公开(公告)日:2022-12-07
申请号:EP21760751.4
申请日:2021-02-24
发明人: MORIWAKI, Yuya , MATSUDA, Tomoya , ASADA, Kosuke , DONKAI, Masaru , NAKAGAWA, Hiroki , MAEO, Keiji , YOSHIDA, Narutoshi , TAKENAKA, Naomi
IPC分类号: C08L33/14
摘要: Provided is a thermosetting resin composition that has high reactivity, can be adapted to various curing conditions, and has extremely high versatility.
The thermosetting resin composition contains a resin component (A) containing -COOR (R is an alkyl group having 50 or less carbon atoms) and a hydroxy group, and a transesterification catalyst (B). A curing start temperature is 130°C or lower, and a gel fraction when cured under a condition of baking at 150°C for 30 minutes is 80% or more.-
5.
公开(公告)号:EP4067395A1
公开(公告)日:2022-10-05
申请号:EP20904427.0
申请日:2020-12-22
发明人: DONKAI, Masaru , MORIWAKI, Yuya , MATSUDA, Tomoya , ASADA, Kosuke , NAKAGAWA, Hiroki , MAEO, Keiji , YOSHIDA, Narutoshi , TAKENAKA, Naomi
IPC分类号: C08F20/28
摘要: Provided is a thermosetting resin composition, from which a cured product having excellent transparency with less yellowing than that in the related art can be obtained, and which is advantageous in cost because a monomer obtained by using an inexpensive raw material is used. An ester compound contains, in one molecule, at least one functional group represented by the following general formula (1) or (2) .
(In both the general formulae (1) and (2), R 1 is an alkyl group having 50 or less carbon atoms.
R 2 is an alkylene group having 50 or less carbon atoms that may contain an oxygen atom and a nitrogen atom as a portion thereof.)-
公开(公告)号:EP3950745A1
公开(公告)日:2022-02-09
申请号:EP20782846.8
申请日:2020-04-01
发明人: MORIWAKI, Yuya , ASADA, Kosuke , DONKAI, Masaru , TAKENAKA, Naomi
IPC分类号: C08F220/28 , C08L33/04 , C09D133/04 , C09D7/61 , C09D7/63
摘要: An object of the present invention is to obtain an aqueous thermosetting resin composition capable of obtaining satisfactory curing performance by a transesterification reaction between alkyl ester and a hydroxyl group. The aqueous thermosetting resin composition includes a resin component (A) that has -COOR (R is an alkyl group having 50 or less carbon atoms) and a hydroxyl group and a transesterification catalyst (B).
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7.
公开(公告)号:EP4059618A1
公开(公告)日:2022-09-21
申请号:EP19952870.4
申请日:2019-11-14
发明人: MORIWAKI, Yuya , MATSUDA, Tomoya , ASADA, Kosuke , DONKAI, Masaru , NAKAGAWA, Hiroki , MAEO, Keiji , YOSHIDA, Narutoshi , TAKENAKA, Naomi
摘要: [Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction.
[Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B).
n = 0 to 20
R 1 is an alkyl group having 50 or less carbon atoms.
R3 is hydrogen or an alkyl group having 10 or less carbon atoms.-
公开(公告)号:EP3988301A1
公开(公告)日:2022-04-27
申请号:EP20836522.1
申请日:2020-07-08
发明人: MORIWAKI, Yuya , MATSUDA, Tomoya , ASADA, Kosuke , DONKAI, Masaru , TAKENAKA, Naomi , NAKAGAWA, Hiroki
IPC分类号: B32B27/30 , C08F290/00 , C08F299/00 , C09D4/02 , C09D7/63
摘要: To provide a resin composition, which has both a thermosetting property and active energy curability, satisfactory performances, and excellent performances including handleability of being inexpensive without having a concern about a short pot life after blending with a thermal cross-linking agent as in the related art. The curable resin composition contains: a resin component (A) containing a (meth)acryloyl group (a), a hydroxy group (b), and an alkyl ester group (c); and an initiator (B).
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9.
公开(公告)号:EP3943520A1
公开(公告)日:2022-01-26
申请号:EP20782103.4
申请日:2020-04-01
发明人: MORIWAKI, Yuya , ASADA, Kosuke , DONKAI, Masaru , TAKENAKA, Naomi
IPC分类号: C08F220/28 , C08L33/04
摘要: An object of the present invention is to provide a thermosetting coating material composition of which a transesterification reaction is a curing reaction, the thermosetting coating material having a property of being usable as a coating material composition. The thermosetting resin composition includes a compound (A) which is a compound (A-a) having two or more -COOR (R is a primary or secondary alkyl group) and/or a compound (A-b) having one -COOR (R is a primary or secondary alkyl group) and a hydroxyl group, and a polyol (B) having two or more hydroxyl groups and a transesterification catalyst (C).
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公开(公告)号:EP3623423A1
公开(公告)日:2020-03-18
申请号:EP18856409.0
申请日:2018-08-21
发明人: MORIWAKI, Yuya , ASADA, Kosuke , DONKAI, Masaru
IPC分类号: C08L33/06 , C08F220/10
摘要: It is an object of the present invention to provide a thermosetting resin composition using a transesterification reaction as a curing reaction, which has a good curability and can be used in various applications.
A thermosetting resin composition comprising a polymer (A) composed of a monomer having a (meth)acrylic acid tertiary alkyl ester and a monomer having a hydroxyl group as a structural unit, and a transesterification catalyst (B) as an essential component, and being organic solvent-type or water-borne,
wherein the polymer (A) has a glass transition temperature of 80°C or lower.
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