Electrode structure for light-emitting diode array
    2.
    发明公开
    Electrode structure for light-emitting diode array 审中-公开
    ElektrodenstrukturfürLeuchtdiodenanordnung

    公开(公告)号:EP2741338A1

    公开(公告)日:2014-06-11

    申请号:EP13195745.8

    申请日:2013-12-04

    摘要: A light emitting device includes a substrate, light emitting cells , each of the light emitting cells including a light emitting structure including lower and upper semiconductor layers, an upper electrode, and a lower electrode, a conductive interconnection layer electrically connecting a lower electrode of a first one of the light emitting cells and an upper electrode of a second one of the light emitting cells, and a current blocking layer disposed to extend from between the upper electrode and the upper semiconductor layer, wherein each light emitting cell further includes a conductive layer arranged to electrically connect the upper electrode of the second light emitting cell to the upper semiconductor layer of the second light emitting cell.

    摘要翻译: 发光装置包括基板,发光单元,每个发光单元包括包括下半导体层和上半导体层的发光结构,上电极和下电极,导电互连层,电连接下电极 发光单元中的第一个和第二发光单元的上电极以及从上电极和上半导体层之间延伸设置的电流阻挡层,其中每个发光单元还包括导电层 布置成将第二发光单元的上电极电连接到第二发光单元的上半导体层。

    Light emitting device and light emitting device array
    3.
    发明公开
    Light emitting device and light emitting device array 审中-公开
    Vichrichtungsanordnung Lichtemittierende Vorrichtung und lichtemittierende

    公开(公告)号:EP2728632A2

    公开(公告)日:2014-05-07

    申请号:EP13191337.8

    申请日:2013-11-04

    摘要: Disclosed is a light emitting device including a substrate, a light emitting structure including lower and upper semiconductor layers having different conductive types, and an active layer disposed between the lower and upper semiconductor layers, the light emitting structure being disposed on the substrate, and a first electrode layer disposed on the upper semiconductor layer, wherein the first electrode layer includes a first adhesive layer and a first bonding layer overlapping each other, wherein a reflective layer is not disposed between the first adhesive layer and the first bonding layer.

    摘要翻译: 公开了一种发光装置,其包括基板,包括具有不同导电类型的下半导体层和上半导体层的发光结构以及设置在下半导体层和上半导体层之间的有源层,发光结构设置在基板上,以及 第一电极层设置在上半导体层上,其中第一电极层包括第一粘合层和彼此重叠的第一粘合层,其中反射层不设置在第一粘合层和第一粘合层之间。