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    Light emitting device
    3.
    发明公开
    Light emitting device 审中-公开
    发光装置

    公开(公告)号：EP2731137A2

    公开(公告)日：2014-05-14

    申请号：EP13192161.1

    申请日：2013-11-08

    申请人： LG Innotek Co., Ltd.

    发明人： Kim, Sung Kyoon ,  Beom, Hee Young ,  Ju, Hyun Seoung ,  Choi, Byung Yeon

    IPC分类号： H01L27/15 ,  H01L33/20 ,  H01L33/38 ,  H01L33/62

    摘要： Disclosed is a light emitting device including a substrate (110), a plurality of light emitting cells (100) separated from each other and disposed on the substrate, and a plurality of conductive interconnection layers (170) electrically connecting two neighboring light emitting cells. Each light emitting cell includes a light emitting structure (120) including a first conductivity-type semiconductor layer (122), an active layer (124) and a second conductivity-type semiconductor layer (126), a first electrode (130), a second electrode (140), and an etching area (S), and the light emitting structure further includes a first side surface (120a) and a second side surface (120b), and if a width between the first side surface and the second side surface is defined as W, the second electrode is disposed in an area between a position separated from the first side surface by 1/5 W and a position separated from the first side surface of the light emitting structure by 1/2 W.

    摘要翻译： 公开了一种发光器件，包括衬底（110），彼此分离并设置在衬底上的多个发光单元（100）以及电连接两个相邻发光单元的多个导电互连层（170）。 每个发光单元包括：包括第一导电型半导体层（122），有源层（124）和第二导电型半导体层（126）的发光结构（120）;第一电极（130）;第二电极 第二电极（140）和蚀刻区域（S），并且发光结构还包括第一侧表面（120a）和第二侧表面（120b），并且如果第一侧表面和第二侧表面 表面被定义为W，第二电极被布置在与第一侧表面分开1/5W的位置和与发光结构的第一侧表面分开1/2W的位置之间的区域中。

    Light emitting device, light emitting device package, and lighting device system
    4.
    发明公开
    Light emitting device, light emitting device package, and lighting device system 审中-公开
    一种发光器件，壳体发光器件和照明装置系统

    公开(公告)号：EP2390931A2

    公开(公告)日：2011-11-30

    申请号：EP11161365.9

    申请日：2011-04-06

    申请人： LG Innotek Co., Ltd.

    发明人： Beom, Hee Young ,  Kim, Sung Kyoon

    IPC分类号： H01L33/20

    CPC分类号： H01L33/20

    摘要： A light emitting device includes a substrate (100), a light emitting structure (105) including a first conductive semiconductor layer (120) having an exposed region, an active layer (130), and a second conductive semiconductor layer (140) on the substrate, a first electrode (170) on the exposed region of the first conductive semiconductor layer, and a second electrode (160) on the second conductive semiconductor layer, wherein a side of the light emitting structure includes a first sloped side (142) sloped from a reference plane, the first sloped side includes a concave-convex pattern (180) having a concave-convex structure in which a first direction length (111-1) is greater than a second direction length (111-2), the reference plane is a plane perpendicular to a direction in which the substrate faces the light emitting structure, and the first direction is a sloped direction of the first sloped side and the second direction is a lateral direction of the first sloped side.

    摘要翻译： 一种发光器件，包括：衬底（100），发光结构（105）包括具有在暴露的区域上的第一导电半导体层（120），有源层（130），并在第二导电半导体层（140） 基板，在所述第一导电半导体层的暴露区域上的第一电极（170），并且所述第二导电半导体层上的第二电极（160），worin发光结构的侧面包括第一倾斜侧面（142）倾斜的 从一个参考平面，所述第一倾斜侧面包括凹凸图案（180），其具有在其中的凹凸结构的第一方向上的长度（111-1）比第二方向上的长度（111-2），参考更大 平面垂直于在其中基板面向发光结构上的方向的平面，并且所述第一方向是所述第一倾斜面的倾斜方向和第二方向与所述第一倾斜面的横向方向。

    Light emitting device, method for fabricating light emittng device, and light emitting device package
    6.
    发明公开
    Light emitting device, method for fabricating light emittng device, and light emitting device package 有权
    一种发光器件，制造发光器件和发光器件封装的方法

    公开(公告)号：EP2372792A3

    公开(公告)日：2015-04-29

    申请号：EP11159085.7

    申请日：2011-03-21

    申请人： LG Innotek Co., Ltd.

    发明人： Beom, Hee Young ,  Na, Min Gyu

    IPC分类号： H01L33/44 ,  H01L33/42

    CPC分类号： H01L33/42 ,  H01L33/20 ,  H01L33/38 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a first conductive type semiconductor layer having a first top surface and a second top surface under the first top surface, an active layer on the first top surface of the first conductive type semiconductor layer, a second conductive type semiconductor layer on the active layer, a first electrode on the second top surface of the first conductive type semiconductor layer, an intermediate refractive layer on the second top surface of the first conductive type semiconductor layer, and a second electrode connected to the second conductive type semiconductor layer.

    摘要翻译： 本发明提供一种发光器件，用于发光器件，发光器件封装，以及照明系统的制造方法，该发光器件包括：具有下一个第一顶表面和第二顶表面上的第一导电型半导体层 第一顶表面，在所述第一导电类型半导体层，有源层上的第二导电型半导体层，在中间折射在第一导电类型半导体层的第二顶表面上的第一电极的第一顶表面上活性层 层在第一半导体层导电类型的第二顶表面上，并连接到第二导电类型半导体层的第二电极。

    Light emitting device and light emitting device array
    7.
    发明公开
    Light emitting device and light emitting device array 审中-公开
    Vichrichtungsanordnung Lichtemittierende Vorrichtung und lichtemittierende

    公开(公告)号：EP2728632A2

    公开(公告)日：2014-05-07

    申请号：EP13191337.8

    申请日：2013-11-04

    申请人： LG Innotek Co., LTD.

    发明人： Choi, Byung Yeon ,  Beom, Hee Young ,  Lee, Yong Gyeong ,  Lee, Ji Hwan ,  Ju, Hyun Seoung ,  Hong, Gi Seok

    IPC分类号： H01L33/40 ,  H01L27/15 ,  H01L33/32 ,  H01L33/46

    CPC分类号： H01L27/156 ,  H01L33/06 ,  H01L33/10 ,  H01L33/145 ,  H01L33/32 ,  H01L33/40 ,  H01L33/46 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a light emitting device including a substrate, a light emitting structure including lower and upper semiconductor layers having different conductive types, and an active layer disposed between the lower and upper semiconductor layers, the light emitting structure being disposed on the substrate, and a first electrode layer disposed on the upper semiconductor layer, wherein the first electrode layer includes a first adhesive layer and a first bonding layer overlapping each other, wherein a reflective layer is not disposed between the first adhesive layer and the first bonding layer.

    摘要翻译： 公开了一种发光装置，其包括基板，包括具有不同导电类型的下半导体层和上半导体层的发光结构以及设置在下半导体层和上半导体层之间的有源层，发光结构设置在基板上，以及 第一电极层设置在上半导体层上，其中第一电极层包括第一粘合层和彼此重叠的第一粘合层，其中反射层不设置在第一粘合层和第一粘合层之间。

    Light emitting device, light emitting device package, and lighting device system
    8.
    发明公开
    Light emitting device, light emitting device package, and lighting device system 审中-公开
    一种发光器件，壳体发光器件和照明装置系统

    公开(公告)号：EP2390931A3

    公开(公告)日：2014-04-30

    申请号：EP11161365.9

    申请日：2011-04-06

    申请人： LG Innotek Co., Ltd.

    发明人： Beom, Hee Young ,  Kim, Sung Kyoon

    IPC分类号： H01L33/20

    CPC分类号： H01L33/20

    摘要： A light emitting device includes a substrate (100), a light emitting structure (105) including a first conductive semiconductor layer (120) having an exposed region, an active layer (130), and a second conductive semiconductor layer (140) on the substrate, a first electrode (170) on the exposed region of the first conductive semiconductor layer, and a second electrode (160) on the second conductive semiconductor layer, wherein a side of the light emitting structure includes a first sloped side (142) sloped from a reference plane, the first sloped side includes a concave-convex pattern (180) having a concave-convex structure in which a first direction length (111-1) is greater than a second direction length (111-2), the reference plane is a plane perpendicular to a direction in which the substrate faces the light emitting structure, and the first direction is a sloped direction of the first sloped side and the second direction is a lateral direction of the first sloped side.