公开(公告)号：EP0802484A1

公开(公告)日：1997-10-22

申请号：EP97103115.8

申请日：1997-02-26

申请人： LSI LOGIC CORPORATION

发明人： Sporck, Nicholas

IPC分类号： G06F11/24 ,  G01R31/3185

CPC分类号： G01R31/3016 ,  G01R31/31858

摘要： A semiconductor device is provided having a circuit for measuring a propagation delay related to metal layers formed on the device. In one embodiment, the circuit includes a first bond pad connected to an input of a first signal path, the first signal path including a first plurality of serially connected logic gates wherein the connection between each logic gate of the first plurality is formed on a first metal layer and a second bond pad connected to an output of a second signal path, the second signal path including a second plurality of serially connected logic gates wherein the connection between each logic gate of the second plurality is formed on a second metal layer, the second signal path being in electrical communication with the first signal path.

摘要翻译： 提供一种半导体器件，其具有用于测量与在器件上形成的金属层相关的传播延迟的电路。 在一个实施例中，电路包括连接到第一信号路径的输入的第一接合焊盘，第一信号路径包括第一多个串联连接的逻辑门，其中第一多个逻辑门之间的连接形成在第一 金属层和连接到第二信号路径的输出的第二接合焊盘，所述第二信号路径包括第二多个串联连接的逻辑门，其中第二多个的每个逻辑门之间的连接形成在第二金属层上， 第二信号路径与第一信号路径电通信。