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1.发明公开Tin, lead or tin/lead alloy electrolytes for high-speed electroplating 失效Zinn，Blei oder Zinn-Blei-LegierungselektrolytenfürElektroplattieren bei hoher Geschwindigkeit。
公开(公告)号：EP0652306A2
公开(公告)日：1995-05-10
申请号：EP95100863.0
申请日：1988-12-09
申请人： LeaRonal, Inc.
摘要： An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of an organic compound having no more than twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moiety of eight carbon atoms or less.
摘要翻译： 一种用于通过高速电镀将锡，铅或锡/铅合金沉积在基底上的电解质，系统和方法，其包括烷基或烷基磺酸的基础溶液; 和溶液可溶性锡化合物或溶液可溶性铅化合物中的至少一种; 和在一个或两个独立或连接的环中具有不超过二十个碳原子的有机化合物的环氧烷缩合化合物，任选被八个或更少碳原子的烷基部分取代。
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2.发明公开
公开(公告)号：EP0652306A3
公开(公告)日：1996-01-03
申请号：EP95100863.0
申请日：1988-12-09
申请人： LeaRonal, Inc.
摘要： An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of an organic compound having no more than twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moiety of eight carbon atoms or less.
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3.发明公开Tin, lead or tin/lead alloy electrolytes for high speed electroplating 失效Zinn-，Blei- und Zinn-Blei-Legierungs-ElektrolytenfürElekroplattieren bei hoher Geschwindigkeit。
公开(公告)号：EP0319997A1
公开(公告)日：1989-06-14
申请号：EP88120625.4
申请日：1988-12-09
申请人： LeaRonal, Inc.
摘要： An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having less than 8 carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of eight carbon atoms or less.
摘要翻译： 一种用于通过高速电镀将锡，铅或锡/铅合金沉积在基底上的电解质，系统和方法，其包括烷基或烷基磺酸的基础溶液; 和溶液可溶性锡化合物或溶液可溶性铅化合物中的至少一种; 和1）具有少于8个碳原子和至少一个羟基的脂族烃的环氧烷缩合化合物，或2）在一个或两个独立或连接的环中具有不超过20个碳原子的有机化合物，其任选地被 8个碳原子或更少的烷基摩尔数。
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4.发明授权
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5.发明授权Tin, lead or tin/lead alloy electrolytes for high speed electroplating 失效锡，铅和锡 - 铅合金的电解质为Elekroplattieren高速。
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