公开(公告)号：EP3742503A1

公开(公告)日：2020-11-25

申请号：EP20174674.0

申请日：2020-05-14

申请人： Lite-On Opto Technology (Changzhou) Co., Ltd. ,  Lite-On Technology Corporation

发明人： LIN, Chen-Hsiu ,  LIN, Wen-Hsiang ,  YU, Chung-Hsien

IPC分类号： H01L33/62

摘要： An LED package structure (S) includes a multilayered circuit board (1), a plurality of lighting elements (21, 22, 23), a control unit (3), a reflecting unit (4), a package unit (5), a plurality of test paths and a plurality of operation paths. The multilayered circuit board (1) includes a plurality of testing pads (151, 152, 153), a first electrical connecting pad (154) and a plurality of second electrical connecting pads (155). The lighting elements (21, 22, 23) are disposed on the multilayered circuit board (1). The control unit (3) is electrically connected to the lighting elements (21, 22, 23). The reflecting unit (4) is disposed on the multilayered circuit board (1) and surrounds the lighting elements (21, 22, 23). The package unit (4) covers the lighting elements (21, 22, 23). The test paths are in electrical connection with the first electrical connecting pad (154), the lighting elements (21, 22, 23) and one of the testing pads (151, 152, 153). The operation paths are in electrical connection with the first electrical connecting pad (154), the control unit (3), the lighting elements (21, 22, 23) and one of the second electrical connecting pads (155).

公开(公告)号：EP3255686A1

公开(公告)日：2017-12-13

申请号：EP16199084.1

申请日：2016-11-16

申请人： Lite-On Opto Technology (Changzhou) Co., Ltd. ,  Lite-On Technology Corporation

发明人： LIN, Yu-Chou ,  LIN, Chen-Hsiu ,  CHEN, Chih-Yuan

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L25/075 ,  H01L33/64

CPC分类号： H01L33/505 ,  G02B5/0278 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L28/20 ,  H01L29/866 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2224/4554

摘要： An LED package structure includes a substrate (1), a circuit layer (2) and an insulating layer (4) both disposed on the substrate (1), a light-emitting unit (5), and a reflective housing (7) integrally formed with the insulating layer (4). The light-emitting unit (5) includes an LED chip (51) and a fluorescent body (52) encapsulating the LED chip (51). The light-emitting unit (5) is mounted on the insulating layer (4) and the circuit layer (2). The fluorescent body (52) of the light emitting unit is spaced apart from the circuit layer (2) with a gap (G) in a range of 3∼10µm. The reflective housing (7) is formed on the insulating layer (4) and the circuit layer (2) and is further filled within the gap (G). A top plane (71) of the reflective housing (7) arranged away from the substrate (1) is lower than or equal to that of the light-emitting unit (5), and a distance (D4) between the two top planes (71, 521) is in a range of 0∼30µm.

摘要翻译： 一种发光二极管封装结构，包括一体设置于所述基板上的基板，一发光单元以及一反射壳体，所述发光单元设置于所述基板上，所述电路层设置于所述基板上， 形成有绝缘层（4）。 发光单元（5）包括LED芯片（51）和封装LED芯片（51）的荧光体（52）。 发光单元（5）安装在绝缘层（4）和电路层（2）上。 发光单元的荧光体（52）以3〜10μm的间隙（G）与电路层（2）隔开。 反射壳体（7）形成在绝缘层（4）和电路层（2）上并进一步填充在间隙（G）内。 远离基板（1）布置的反射壳体（7）的顶部平面（71）低于或等于发光单元（5）的顶部平面（71），并且两个顶部平面之间的距离（D4） 71,521）在0〜30μm的范围内。