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公开(公告)号：EP3852091A1
公开(公告)日：2021-07-21
申请号：EP21152270.1
申请日：2021-01-19
发明人： LIN, Chin-Kuan , CHENG, Ju-Ling , LIN, Yi-Chu
IPC分类号： G09F9/302
摘要： A digital display (Z) including a light unit (1), a display unit (2) and a fixing unit (F) is provided. The light unit (1) is connected to the display unit (2), and the display unit (2) and the fixing unit (F) either are a single component or are each an independent component. The digital display (Z) can fix the display unit (2) on an external substrate (S) in an upright manner through the fixing unit (F).
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公开(公告)号：EP3823046A1
公开(公告)日：2021-05-19
申请号：EP20207159.3
申请日：2020-11-12
发明人： CHEN, Bo-Jhih , LIN, Zi-Jun , CHIU, Kuo-Ming , JEN, Yung-Chang , CHOU, Meng-Sung , HSIEH, Chang-Hung
IPC分类号： H01L31/0203 , H01L31/173 , H01L25/16 , H01L31/0232
摘要： A light sensing module (Z1, Z2, Z3, Z4, Z5) and an electronic device (D) using the same are provided. The light sensing module includes a substrate (1), a light sensing unit (2), a first light-transmissive component (3a) and a blocking wall (4). The light sensing unit (2) is disposed on the substrate (1) to sense an intensity of a working light beam. The first light-transmissive component (3a) covers the light sensing unit (2), and has a first refractive index that is between a refractive index of the light sensing unit (2) and a refractive index of air. The blocking wall (4) is disposed on the substrate (1), and surrounds the light sensing unit (2) and the first light-transmissive component (3a).
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公开(公告)号：EP3696800A1
公开(公告)日：2020-08-19
申请号：EP20155578.6
申请日：2020-02-05
发明人： SUN, Fang-Jung , HSU, Shih-Chang , WU, Chao-Ming
摘要： A display device includes a patterned panel (2) and a light emitting module (1), and the patterned panel (2) includes: a light-transmitting substrate (S), a first light-transmitting portion (21), a second light-transmitting portion (22) and a third light-transmitting portion (23). Each of the light-transmitting portions respectively has a first transmission spectrum, a second transmission spectrum and a third transmission spectrum, in which the third light-transmitting portion (23) is adjacent to the first light-transmitting portion (21) and the second light-transmitting portion (22), and the third transmission spectrum has a first overlapping part with the first transmission spectrum, and has a second overlapping part with the second transmission spectrum. The light emitting module (1) includes a first light emitting unit (11) and a second light emitting unit (12), the first light emitting unit (11) emits a first light having a peak wavelength in the first overlapping part, and the second light emitting unit (12) emits a second light having a peak wavelength in the second overlapping part.
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4.发明授权
公开(公告)号：EP2824722B1
公开(公告)日：2017-09-06
申请号：EP14176530.5
申请日：2014-07-10
发明人： Lin, Chen-Hsiu
CPC分类号： H01L33/62 , F21V19/001 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
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公开(公告)号：EP2930748B1
公开(公告)日：2020-09-23
申请号：EP15154880.7
申请日：2015-02-12
发明人： Lee, Hou-Te , Ying, Tsung-Kang , Hsu, Erh-Chan
IPC分类号： H01L25/075 , H01L33/48 , H01L33/56 , H01L33/62 , H01L33/54
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公开(公告)号：EP3742503A1
公开(公告)日：2020-11-25
申请号：EP20174674.0
申请日：2020-05-14
发明人： LIN, Chen-Hsiu , LIN, Wen-Hsiang , YU, Chung-Hsien
IPC分类号： H01L33/62
摘要： An LED package structure (S) includes a multilayered circuit board (1), a plurality of lighting elements (21, 22, 23), a control unit (3), a reflecting unit (4), a package unit (5), a plurality of test paths and a plurality of operation paths. The multilayered circuit board (1) includes a plurality of testing pads (151, 152, 153), a first electrical connecting pad (154) and a plurality of second electrical connecting pads (155). The lighting elements (21, 22, 23) are disposed on the multilayered circuit board (1). The control unit (3) is electrically connected to the lighting elements (21, 22, 23). The reflecting unit (4) is disposed on the multilayered circuit board (1) and surrounds the lighting elements (21, 22, 23). The package unit (4) covers the lighting elements (21, 22, 23). The test paths are in electrical connection with the first electrical connecting pad (154), the lighting elements (21, 22, 23) and one of the testing pads (151, 152, 153). The operation paths are in electrical connection with the first electrical connecting pad (154), the control unit (3), the lighting elements (21, 22, 23) and one of the second electrical connecting pads (155).
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7.发明公开Led structure, metallic frame of led structure; and carrier module 有权LED-Struktur，Metallrahmen der LED-Struktur undTrägermodul
公开(公告)号：EP2824722A1
公开(公告)日：2015-01-14
申请号：EP14176530.5
申请日：2014-07-10
发明人： Lin, Chen-Hsiu
CPC分类号： H01L33/62 , F21V19/001 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
摘要： A metallic frame (1) of an LED structure includes two conductive frames (11) spaced apart from each other with a gap and a plurality of extending arms (12) respectively and integrally extended from the conductive frames (11). Each conductive frame (11) includes a top surface (111), a bottom surface (112), and a lateral surface (113) connecting the top and bottom surfaces (111, 112). Each top surface (111) comprises a sealed region (1111) and a mounting region (1112) surrounded by the sealed region (1111), and the sealed and mounting regions (1111, 1112) of each conductive frame (11) are defined by an insulating body (2). Each conductive frame (11) has at least one slot (1113) concavely formed on the sealed region (1111), and the lateral surface (113) is formed with two openings (1113a, 1113b) and the slot (1113) is communicated with the two openings (1113a, 1113b), such that the slot (1113) of each of the conductive frames (11) is configured to separate at least one of the extending arms (12) from the mounting region (1112) of the conductive frames (11).
摘要翻译： LED结构的金属框架（1）包括彼此间隔开的两个导电框架（11）和分别从导电框架（11）整体延伸的多个延伸臂（12）。 每个导电框架（11）包括顶表面（111），底表面（112）和连接顶表面和底表面（111,112）的侧表面（113）。 每个顶表面（111）包括由密封区域（1111）包围的密封区域（1111）和安装区域（1112），并且每个导电框架（11）的密封和安装区域（1111,1112）由 绝缘体（2）。 每个导电框架（11）具有凹入地形成在密封区域（1111）上的至少一个槽（1113），并且侧表面（113）形成有两个开口（1113a，1113b），并且槽（1113）与 两个开口（1113a，1113b），使得每个导电框架（11）的槽（1113）被构造成将至少一个延伸臂（12）与导电框架的安装区域（1112）分离 （11）。
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公开(公告)号：EP3255686A1
公开(公告)日：2017-12-13
申请号：EP16199084.1
申请日：2016-11-16
发明人： LIN, Yu-Chou , LIN, Chen-Hsiu , CHEN, Chih-Yuan
CPC分类号： H01L33/505 , G02B5/0278 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L28/20 , H01L29/866 , H01L33/46 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2224/4554
摘要： An LED package structure includes a substrate (1), a circuit layer (2) and an insulating layer (4) both disposed on the substrate (1), a light-emitting unit (5), and a reflective housing (7) integrally formed with the insulating layer (4). The light-emitting unit (5) includes an LED chip (51) and a fluorescent body (52) encapsulating the LED chip (51). The light-emitting unit (5) is mounted on the insulating layer (4) and the circuit layer (2). The fluorescent body (52) of the light emitting unit is spaced apart from the circuit layer (2) with a gap (G) in a range of 3∼10µm. The reflective housing (7) is formed on the insulating layer (4) and the circuit layer (2) and is further filled within the gap (G). A top plane (71) of the reflective housing (7) arranged away from the substrate (1) is lower than or equal to that of the light-emitting unit (5), and a distance (D4) between the two top planes (71, 521) is in a range of 0∼30µm.
摘要翻译： 一种发光二极管封装结构，包括一体设置于所述基板上的基板，一发光单元以及一反射壳体，所述发光单元设置于所述基板上，所述电路层设置于所述基板上， 形成有绝缘层（4）。 发光单元（5）包括LED芯片（51）和封装LED芯片（51）的荧光体（52）。 发光单元（5）安装在绝缘层（4）和电路层（2）上。 发光单元的荧光体（52）以3〜10μm的间隙（G）与电路层（2）隔开。 反射壳体（7）形成在绝缘层（4）和电路层（2）上并进一步填充在间隙（G）内。 远离基板（1）布置的反射壳体（7）的顶部平面（71）低于或等于发光单元（5）的顶部平面（71），并且两个顶部平面之间的距离（D4） 71,521）在0〜30μm的范围内。
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公开(公告)号：EP2930748A1
公开(公告)日：2015-10-14
申请号：EP15154880.7
申请日：2015-02-12
发明人： Lee, Hou-Te , Ying, Tsung-Kang , Hsu, Erh-Chan
IPC分类号： H01L25/075 , G09F9/33 , H01L33/48 , H01L33/52 , H01L33/62
摘要： A light-emitting diode (LED) package structure (2) includes: an insulating substrate (20) that has a front bonding pad assembly (22); a dark-colored die-attach adhesive (26); blue and green LED chips (B, G) mounted on the front bonding pad assembly (22) via the dark-colored die-attach adhesive (26); and a dark-colored and light-transmissible encapsulant (21) that is disposed on the insulating substrate (20) and that encapsulates the blue and green LED chips (B, G). The encapsulant (21) has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.
摘要翻译： 发光二极管（LED）封装结构（2）包括：具有前焊盘组件（22）的绝缘衬底（20）; 暗色的贴片粘合剂（26）; 蓝色和绿色LED芯片（B，G），经由深色的芯片附着粘合剂（26）安装在前焊盘组件（22）上。 以及设置在绝缘基板（20）上并且封装蓝色和绿色LED芯片（B，G）的深色和透光的密封剂（21）。 密封剂（21）的蓝色光的透光率为7％〜28％，绿色光的透光率为9％〜30％。
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