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公开(公告)号：EP3308407A1
公开(公告)日：2018-04-18
申请号：EP16730172.0
申请日：2016-06-06
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , H01L33/502 , H01L2933/005
摘要： Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.
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公开(公告)号：EP3308407B1
公开(公告)日：2018-12-12
申请号：EP16730172.0
申请日：2016-06-06
申请人： Lumileds LLC
CPC分类号： H01L33/56 , H01L33/502 , H01L2933/005
摘要： Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.
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