摘要:
A very compact thermal printing head which may be manufactured at low cost is proposed. The thermal printing head integrally comprises a given multiple of heaters formed in an array, and a plurality of semiconductor devices each having at least a plurality of transistors which are respectively connected to heaters and a shift register which transfers an image signal for selectively switching the plurality of transistors. Straight lead wires are used to connect the semiconductor devices and the heaters, and L-shaped or inverted L-shaped lead wires are used to connect the semiconductor devices and a set of multi-layer wiring conductors having terminal mount portions of the head. These straight and L-shaped (or inverted L-shaped) lead wires are respectively supported on electrically insulating flexible films obtained by the TAB (tape automated bonding) method.
摘要:
A thermal recording head and system including a plurality of heating elements (1) ranged in one line, wherein N groups of heating elements are sequentially selected to be actuated by selecting a respective one of every N number of adjacent heating elements in order for N times of divisional recording for one line.
摘要:
A very compact thermal printing head which may be manufactured at low cost is proposed. The thermal printing head integrally comprises a given multiple of heaters formed in an array, and a plurality of semiconductor devices each having at least a plurality of transistors which are respectively connected to heaters and a shift register which transfers an image signal for selectively switching the plurality of transistors. Straight lead wires are used to connect the semiconductor devices and the heaters, and L-shaped or inverted L-shaped lead wires are used to connect the semiconductor devices and a set of multi-layer wiring conductors having terminal mount portions of the head. These straight and L-shaped (or inverted L-shaped) lead wires are respectively supported on electrically insulating flexible films obtained by the TAB (tape automated bonding) method.
摘要:
An improved thermal head for thermal recording includes an array of a plurality of heat generator elements (101) arranged in a direction, and a plurality of semiconductor chips (201) each thereof including a plurality of transistors (112) for selectively energizing the plural heat generator elements. An array of electrode terminals (201a) including the individual electrode terminals of the plural transistors each thereof being connected to one electrode of each of the plural heat generator elements are formed on one of the major surfaces of each of the semiconductor chips in a direction substantially perpendicular to the direction of the heat generator element array. The thermal head further comprises a flexible film (202) associated with each of the semiconductor chips and having a slot or a recess (202H) surrounding the electrode terminal array. One of major surfaces of the flexible film is placed on the major surface of the semiconductor chip on which the electrode terminal array is disposed, and a plurality of leads (202a, 202b) having one end thereof connected respectively to the electrode terminals are disposed on the other major surface of the flexible film substantially in parallel with the heat generator element array. By virtue of the above structure, the thermal head is suitable for thermal recording with a high recording density and it can be manufactured at a low cost.
摘要:
@ A dye transfer sheet for heat-sensitive recording is described, which sheet comprises a support and a basic dye layer formed on the support. The basic dye is preferably an aromatic tertiary amine. Better results are obtained when the dye transfer sheet is used inc combination with an image-receiving sheet having an electron acceptor layer thereon. A heat-sensitive recording apparatus suitable for the recording of the above-mentioned type of dye transfer sheet is also described.