Light-emitting diode device and method for fabricating the same
    1.
    发明公开
    Light-emitting diode device and method for fabricating the same 审中-公开
    Leuchtdiodenanordnung und Verfahren zu deren Herstellung

    公开(公告)号:EP0911887A2

    公开(公告)日:1999-04-28

    申请号:EP98120254.2

    申请日:1998-10-26

    IPC分类号: H01L33/00

    摘要: The light-emitting diode device of the present invention includes an active layer (17), a p-type contact layer (22), a Schottky electrode (23) and an ohmic electrode (24). The active layer is formed over an n-type semiconductor substrate (11). The contact layer (22) is formed over the active layer (17). The Schottky electrode (23) is selectively formed on a portion of the contact layer (22) and makes Schottky contact with said portion of the contact layer (22). The ohmic electrode (24) surrounds the Schottky electrode (23) on the contact layer (22), is electrically connected to the Schottky electrode (23), and transmits the light emitted from the active layer (17). Alternatively, the Schottky electrode may be replaced by a pad electrode (42A) in ohmic contact with the contact layer (22,41A), a high-resistance region (43) being formed as a current blocking layer under the pad electrode (42A).

    摘要翻译: 本发明的发光二极管器件包括有源层(17),p型接触层(22),肖特基电极(23)和欧姆电极(24)。 有源层形成在n型半导体衬底(11)上。 接触层(22)形成在有源层(17)上。 肖特基电极(23)选择性地形成在接触层(22)的一部分上,并与接触层(22)的所述部分进行肖特基接触。 欧姆电极(24)围绕接触层(22)上的肖特基电极(23),电连接到肖特基电极(23),并透射从有源层(17)发射的光。 或者,肖特基电极可以由与接触层(22,41A)欧姆接触的焊盘电极(42A)替代,高电阻区域(43)形成为焊盘电极(42A)下方的电流阻挡层, 。