摘要:
In the pattern formation method of this invention, a resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1, and an acid generator, wherein R 1 and R 2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom. Then, the resist film is irradiated with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.
摘要:
A resist film which generates a sulfonic acid through irradiation with an energy beam is irradiated with a KrF excimer laser beam through a mask to generate a sulfonic acid in the exposed area. Then, a semiconductor substrate is immersed in a solution of polysiloxane having an amino group, and dried. This causes the electrostatic adsorption of the polysiloxane having an ammonium ion on the surface of the exposed area of the resist film where a sulfonic acid ion is present to form a polysiloxane film. Thereafter, the resist film is subjected to O 2 plasma etching by using the polysiloxane film as a mask to form a resist pattern.
摘要:
A patterning material includes a polymer represented by a general formula: wherein R 1 indicates a hydrogen atom or an alkyl group; R 2 indicates a hydrophobic protecting group which is easily desorbed through a function of an acid; R 3 indicates a hydrogen atom or an alkyl group; R 4 and R 5 independently indicate a hydrogen atom, an alkyl group, a phenyl group or an alkenyl group, or together indicate a cyclic alkyl group, a cyclic alkenyl group or a cyclic alkyl or alkenyl group having a phenyl group; x satisfies a relationship of 0
摘要:
A pattern forming material includes a binary copolymer represented by the following general formula or a ternary or higher copolymer obtained by further polymerizing the binary copolymer with another group: wherein R 1 indicates a hydrogen atom or an alkyl group; R 2 and R 3 independently indicate a hydrogen atom, an alkyl group, a phenyl group or an alkenyl group or together indicate a cyclic alkyl group, a cyclic alkenyl group, a cyclic alkyl group having a phenyl group or a cyclic alkenyl group having a phenyl group; R 4 indicates a hydrogen atom or an alkyl group; x satisfies a relationship of 0
摘要:
A pattern forming material comprising a copolymer including a first group for generating a base through irradiation with an energy beam and a second group having an acidic property.
摘要:
A patterning material includes a polymer represented by a general formula: wherein R 6 indicates a hydrophobic protecting group which is easily desorbed through a function of said acid; R 7 indicates a hydrogen atom or an alkyl group; R 8 and R 9 independently indicate a hydrogen atom, an alkyl group, a phenyl group or an alkenyl group, or together indicate a cyclic alkyl group, a cyclic alkenyl group or a cyclic alkyl or alkenyl group having a phenyl group; x satisfies a relationship of 0
摘要:
In the pattern formation method of this invention, a resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1, and an acid generator, wherein R 1 and R 2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom. Then, the resist film is irradiated with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.
摘要:
The pattern forming material of the present invention includes a polymer having a group which generates an acid when the polymer is irradiated with an energy beam or heated and a compound which generates a base when the compound is irradiated with an energy beam. The polymer is a binary polymer or a polymer of a higher degree obtained by polymerizing another group with a compound represented by the following general formula: where R 1 indicates a hydrogen atom or an alkyl group, and R 2 and R, independently indicate a hydrogen atom, an alkyl group, a phenyl group or an alkenyl group, or together indicate a cyclic alkyl group, a cyclic alkenyl group, a cyclic alkyl group having a phenyl group or a cyclic alkenyl group having a phenyl group.