公开(公告)号：EP0843366A4

公开(公告)日：2000-09-27

申请号：EP97922202

申请日：1997-05-27

申请人： MATSUSHITA ELECTRIC WORKS LTD

发明人： MAEGAWA NOBUTERU ,  OKADA HIROAKI ,  TSUZAKI MICHIMASA ,  SAKAI YURI ,  SHIMODA KATSUYOSHI ,  KOMATSU TERUAKI ,  MURASE SHINYA ,  INOUE HIROYUKI ,  SAGAWA MASAYUKI

IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L35/08

CPC分类号： H01L35/32 ,  H01L35/325 ,  H01L35/34 ,  Y10S257/93

摘要： In a method for manufacturing a thermoelectric module in which a plurality of thermoelectric chips is arranged in a matrix-like state and electrically connected in series with each other between first and second insulating substrates and the first substrate side is heated and the second substrate is cooled with a Peltier effect produced by each thermoelectric chip, a lateral bridge is cut simultaneously with N- and P-type long thermoelectric bars which are to be cut into the thermoelectric chips after first electrodes which are adjacently arranged to each other in the direction of row are retained on the first substrate by using a first conductor plate which integrally couples the thermoelectric bars with the first electrode in one body with the lateral bridge. Since the thermoelectric bars on the first eletrodes are surely supported by the first substrate, the thermoelectric bars can be surely and easily cut into the chips and, since the chips are supported by the first substrate together with the electrodes, the chips can be held stably in the succeeding manufacturing process of a thermoelectric module and the module can be assembled easily.