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    Thermoelectric Conversion Material
    1.
    发明公开
    Thermoelectric Conversion Material 审中-公开
    热电材料

    公开(公告)号：EP2468693A2

    公开(公告)日：2012-06-27

    申请号：EP11194975.6

    申请日：2011-12-21

    申请人： Hitachi Ltd.

    发明人： Fujieda, Tadashi ,  Naito, Takashi ,  Aoyagi, Takuya

    IPC分类号： C03C4/14 ,  C03C10/02 ,  H01L35/22 ,  C03C23/00

    CPC分类号： H01L35/18 ,  C03B32/02 ,  C03C3/21 ,  C03C4/14 ,  C03C10/00 ,  H01L35/00 ,  H01L35/22 ,  Y10S257/93

    摘要： A thermoelectric conversion material is provided, in which only a desired crystal is selectively precipitated. An M x V 2 O 5 crystal is selectively precipitated in vanadium-based glass, wherein M is one metal element selected from the group consisting of iron, arsenic, antimony, bismuth, tungsten, molybdenum, manganese, nickel, copper, silver, an alkali metal and an alkaline earth metal, and 0
    The glass may comprise in mol% 10 Cu 2 O, 70 V 2 O 5 , 10 Fe 2 O 3 , 10 P 2 O 5 . The glass is converted to a glass-ceramic using microwave heating.

    摘要翻译： 提供一种热电转换材料，其中仅选择性地沉淀所需的晶体。 在钒基玻璃中选择性地析出M x V 2 O 5晶体，其中M是选自铁，砷，锑，铋，钨，钼，锰，镍，铜，银， 碱金属和碱土金属，0

    METHOD FOR MANUFACTURING THERMOELECTRIC MODULE
    6.
    发明公开
    METHOD FOR MANUFACTURING THERMOELECTRIC MODULE 失效
    PROCESS热的电气模块

    公开(公告)号：EP0843366A4

    公开(公告)日：2000-09-27

    申请号：EP97922202

    申请日：1997-05-27

    申请人： MATSUSHITA ELECTRIC WORKS LTD

    发明人： MAEGAWA NOBUTERU ,  OKADA HIROAKI ,  TSUZAKI MICHIMASA ,  SAKAI YURI ,  SHIMODA KATSUYOSHI ,  KOMATSU TERUAKI ,  MURASE SHINYA ,  INOUE HIROYUKI ,  SAGAWA MASAYUKI

    IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L35/08

    CPC分类号： H01L35/32 ,  H01L35/325 ,  H01L35/34 ,  Y10S257/93

    摘要： In a method for manufacturing a thermoelectric module in which a plurality of thermoelectric chips is arranged in a matrix-like state and electrically connected in series with each other between first and second insulating substrates and the first substrate side is heated and the second substrate is cooled with a Peltier effect produced by each thermoelectric chip, a lateral bridge is cut simultaneously with N- and P-type long thermoelectric bars which are to be cut into the thermoelectric chips after first electrodes which are adjacently arranged to each other in the direction of row are retained on the first substrate by using a first conductor plate which integrally couples the thermoelectric bars with the first electrode in one body with the lateral bridge. Since the thermoelectric bars on the first eletrodes are surely supported by the first substrate, the thermoelectric bars can be surely and easily cut into the chips and, since the chips are supported by the first substrate together with the electrodes, the chips can be held stably in the succeeding manufacturing process of a thermoelectric module and the module can be assembled easily.

    SUPERLATTICE STRUCTURES PARTICULARLY SUITABLE FOR USE AS THERMOELECTRIC COOLING MATERIALS
    7.
    发明公开
    SUPERLATTICE STRUCTURES PARTICULARLY SUITABLE FOR USE AS THERMOELECTRIC COOLING MATERIALS 失效
    超晶格结构特别适合作为热电KUHLUNGSMATERIALIEN。

    公开(公告)号：EP0679289A1

    公开(公告)日：1995-11-02

    申请号：EP93922133.0

    申请日：1993-08-30

    申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY

    发明人： HARMAN, Theodore, C.

    IPC分类号： H01L35

    CPC分类号： H01L35/16 ,  Y10S257/93

    摘要： A superlattice comprising alternating layers of (PbTeSe)m and (BiSb)n (where m and n are the number of PbTeSe and BiSb monolayers per superlattice period, respectively) having engineered electronic structures for improved thermoelectric cooling materials (and other uses) may be grown by molecular beam epitaxial growth. Preferably, for short periods, n + m ∫ 50. However, superlattice films with 10,000 or more such small periods may be grown. For example, the superlattice may comprise alternating layers of (PbTe1-zSez)m and (BixSb1-x)n. According to a preferred embodiment, the superlattice comprises a plurality of layers comprising m layers of PbTe0.8Se0.2 and n layers of Bi0.9Sb0.1, where m and n are preferably between 2 and 20.

    Superconducting apparatus having dew-preventable peltier-effect element integrated therewith
    8.
    发明公开
    Superconducting apparatus having dew-preventable peltier-effect element integrated therewith 失效
    具有集成在其中嵌合预防性珀耳帖元件的超导装置。

    公开(公告)号：EP0630059A3

    公开(公告)日：1995-02-01

    申请号：EP94304279.6

    申请日：1994-06-14

    申请人： SHARP KABUSHIKI KAISHA

    发明人： Kataoka, Shoei ,  Nojima, Hideo

    IPC分类号： H01L39/04 ,  H01L39/02 ,  H01L35/02 ,  F25B21/02

    CPC分类号： H01L35/00 ,  F25B21/02 ,  H01L39/04 ,  Y10S257/93

    摘要： A superconducting apparatus has a superconducting element (1), which is a member to be cooled and which exhibits a superconducting phenomenon; an electronic cooling element (2) composed of a cooling electrode (8) provided to the superconducting element (1) via an insulating layer (6), p-type and n-type semiconductor layers (2a, 2b) formed to be connected to the cooling electrode (8), heat-radiation electrodes (7) provided to the semiconductor layers (2a, 2b) independently of each other, and a heat-radiation plate (5) provided to the heat-radiation electrodes (7) via the insulating layer (6); lead wires (11, 9) for electrically connecting the superconducting element (1) and the electronic cooling element to external circuits, respectively. The superconducting element (1) and the electronic cooling element, which are integrally packaged, are installed within the first container (3). Internally sealed by an inert gas atmosphere, the first container (3) is installed within the second container (4). The second container (4) is internally sealed in a vacuum state.

    Package for housing electronic component
    10.
    发明公开
    Package for housing electronic component 失效
    Packung eines elektronischen Bauelementes。

    公开(公告)号：EP0454328A1

    公开(公告)日：1991-10-30

    申请号：EP91303250.4

    申请日：1991-04-12

    申请人： International Business Machines Corporation

    发明人： Mansuria, Mohanlal S. ,  Mosley, Joseph M. ,  Musa, Richard D. ,  Tuozzolo, Vito J.

    IPC分类号： H01L23/38

    CPC分类号： H01L23/38 ,  H01L2224/16225 ,  Y10S257/93

    摘要： A thermoelectrically cooled package (10) for housing an electronic component is provided. In a preferred form of the invention the electronic component is an integrated circuit chip (12) and the package includes a thermally conductive dielectric substrate (14), an input connecting portion and an output connecting portion (16) supported by the dielectric substrate, and the integrated circuit chip includes an input terminal and output terminal (18). The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material (24). The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.

    摘要翻译： 提供一种用于容纳电子部件的热电冷却封装（10）。 在本发明的优选形式中，电子部件是集成电路芯片（12），并且封装包括导热电介质基板（14），输入连接部分和由电介质基板支撑的输出连接部分（16），以及 集成电路芯片包括输入端子和输出端子（18）。 输入端经由第一导电材料电连接到输入连接部分，并且输出端经由第二导电材料（24）电连接到输出连接部分。 当信号通过第一导电材料和第二导电材料时，第一导电材料和第二导电材料对集成电路芯片进行热电冷却。