公开(公告)号：EP4112294A1

公开(公告)日：2023-01-04

申请号：EP21759664.2

申请日：2021-02-24

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： KOBAYASHI Takashi ,  HASHIGUCHI Kazuhiro ,  HASEBE Keiichi

IPC分类号： B32B5/24 ,  B32B27/36 ,  C08G73/16 ,  C08K5/315 ,  C08J5/24 ,  B32B15/08 ,  B32B15/09 ,  B32B15/14 ,  H05K1/03

摘要： Provided is a resin composition having high thermal resistance and low dielectric properties, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a cyanate ester compound (B) containing two or more aromatic moieties per molecule, the aromatic moieties being replaced by at least one cyanato group: where in Formula (M1), A is a four- to six-membered alicyclic group: