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公开(公告)号：EP0564660B1
公开(公告)日：1998-01-28
申请号：EP92922491.3
申请日：1992-10-26
发明人： UEKI, Toru 16-1, Kitashin , YOSHIMURA, Masaji , KANEZAKI, Kazuharu 2070, Iijimacho , IWATA, Ineo 3-42-7-144, Hirado , TAKIGUCHI, Minoru 4-5-45, Dai
CPC分类号： C08K3/346 , C08K7/00 , C08K7/06 , C08K7/10 , C08K2201/016 , H01L2924/0002 , H05K13/0084 , C08L71/12 , H01L2924/00
摘要： A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10?1 to 1012¿ Φ. This tray is excellent in conductivity and heat resistance and reduced in warpage.
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公开(公告)号：EP0564660A1
公开(公告)日：1993-10-13
申请号：EP92922491.3
申请日：1992-10-26
发明人： UEKI, Toru 16-1, Kitashin , YOSHIMURA, Masaji , KANEZAKI, Kazuharu 2070, Iijimacho , IWATA, Ineo 3-42-7-144, Hirado , TAKIGUCHI, Minoru 4-5-45, Dai
CPC分类号： C08K3/346 , C08K7/00 , C08K7/06 , C08K7/10 , C08K2201/016 , H01L2924/0002 , H05K13/0084 , C08L71/12 , H01L2924/00
摘要： A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10¹ to 10¹² Ω. This tray is excellent in conductivity and heat resistance and reduced in warpage.
摘要翻译： 一种用于集成电路的托盘，其由热塑性树脂组合物制成，所述热塑性树脂组合物包含100重量份的聚苯醚树脂，0.1至40重量份数均纤维长度在0.05至1.5毫米范围内的碳纤维，以及 0.1至50重量份的具有20或更高的纵横比的片状无机填料，其表面电阻率在10〜10 -2欧米茄的范围内。 该托盘导电性和耐热性优异，翘曲减小。
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