公开(公告)号：EP0908980A2

公开(公告)日：1999-04-14

申请号：EP98118964.0

申请日：1998-10-07

申请人： MOLEX INCORPORATED

发明人： Hideyuki, Hirata ,  Soichi, Watanabe

IPC分类号： H01R23/70 ,  H01R13/648

CPC分类号： H05K5/0291 ,  H01R12/57 ,  H01R12/707 ,  H01R12/716 ,  H01R13/648 ,  H01R2201/06 ,  H05K5/0295

摘要： Disclosed is an improved card connector (1) comprising a shell assembly (2) and a pin connector assembly (3). The pin connector assembly has a plurality of connecting terminals (19) and grounding terminals (27) mounted therein. Connection pins (20) of the connecting terminals are arranged in upper and lower levels in the insulating housing. The grounding terminals are arranged parallel to the connecting terminals at upper and lower levels. The upper and lower grounding terminals are electrically coupled in the insulating housing, and a single row of DIP-type solder tails extending from the lower grounding terminals can be soldered to selected conductors on a printed circuit board.

摘要翻译： 公开了一种包括外壳组件（2）和销连接器组件（3）的改进的卡连接器（1）。 销连接器组件具有安装在其中的多个连接端子（19）和接地端子（27）。 连接端子的连接引脚（20）被布置在绝缘外壳中的上层和下层中。 接地端子平行于上层和下层的连接端子布置。 上部和下部接地端子电耦合在绝缘外壳中，并且从下部接地端子延伸的单排DIP型焊接尾部可以焊接到印刷电路板上的选定导体。

公开(公告)号：EP0863584A2

公开(公告)日：1998-09-09

申请号：EP98103692.4

申请日：1998-03-03

申请人： MOLEX INCORPORATED

发明人： Hideyuki, Hirata

IPC分类号： H01R23/68

CPC分类号： H01R12/725

摘要： An improved electrical connector assembly for mounting to a printed circuit board (6) and for receiving a PC card. The electrical connector assembly includes a housing (3) having signal terminals (1) and ground terminals (2), wherein the tail portions (11) of the signal terminals are of surface mount type and the tail portions (21) of the ground terminals are of through-hole type. The tail portions of the ground terminals extend in at least one row toward the circuit board between the tail portions of the signal terminals and the rear end of the housing. In this configuration, the signal terminal tail portions and the ground terminal tail portions can be simultaneously soldered and all of the solder joints can be inspected without obstruction, the surface mount solder joints inspected from an upper surface (7) of the circuit board and the through-hole solder joints can be inspected from a lower surface (8) of the circuit board. The ground terminals, in the form of a unitary ground shield, are positioned on an upper surface of the housing (3).

摘要翻译： 一种用于安装到印刷电路板（6）并用于接收PC卡的改进的电连接器组件。 电连接器组件包括具有信号端子（1）和接地端子（2）的壳体（3），其中信号端子的尾部（11）具有表面安装型和接地端子的尾部（21） 是通孔型。 接地端子的尾部在信号端子的尾部和壳体的后端之间至少一排朝向电路板延伸。 在该结构中，可以同时焊接信号端子尾部和接地端子尾部，并且可以不阻碍地检查所有焊点，从电路板的上表面（7）检查表面安装焊点， 可以从电路板的下表面（8）检查通孔焊点。 以单一接地屏蔽形式的接地端子位于壳体（3）的上表面上。

公开(公告)号：EP0908980A3

公开(公告)日：2000-06-21

申请号：EP98118964.0

申请日：1998-10-07

申请人： MOLEX INCORPORATED

发明人： Hideyuki, Hirata ,  Soichi, Watanabe

IPC分类号： H01R23/70 ,  H01R13/648

CPC分类号： H05K5/0291 ,  H01R12/57 ,  H01R12/707 ,  H01R12/716 ,  H01R13/648 ,  H01R2201/06 ,  H05K5/0295

摘要： Disclosed is an improved card connector (1) comprising a shell assembly (2) and a pin connector assembly (3). The pin connector assembly has a plurality of connecting terminals (19) and grounding terminals (27) mounted therein. Connection pins (20) of the connecting terminals are arranged in upper and lower levels in the insulating housing. The grounding terminals are arranged parallel to the connecting terminals at upper and lower levels. The upper and lower grounding terminals are electrically coupled in the insulating housing, and a single row of DIP-type solder tails extending from the lower grounding terminals can be soldered to selected conductors on a printed circuit board.

公开(公告)号：EP0863584A3

公开(公告)日：1999-06-16

申请号：EP98103692.4

申请日：1998-03-03

申请人： MOLEX INCORPORATED

发明人： Hideyuki, Hirata

IPC分类号： H01R23/68

CPC分类号： H01R12/725

摘要： An improved electrical connector assembly for mounting to a printed circuit board (6) and for receiving a PC card. The electrical connector assembly includes a housing (3) having signal terminals (1) and ground terminals (2), wherein the tail portions (11) of the signal terminals are of surface mount type and the tail portions (21) of the ground terminals are of through-hole type. The tail portions of the ground terminals extend in at least one row toward the circuit board between the tail portions of the signal terminals and the rear end of the housing. In this configuration, the signal terminal tail portions and the ground terminal tail portions can be simultaneously soldered and all of the solder joints can be inspected without obstruction, the surface mount solder joints inspected from an upper surface (7) of the circuit board and the through-hole solder joints can be inspected from a lower surface (8) of the circuit board. The ground terminals, in the form of a unitary ground shield, are positioned on an upper surface of the housing (3).