公开(公告)号：EP0908977A3

公开(公告)日：2000-06-21

申请号：EP98118961.6

申请日：1998-10-07

申请人： MOLEX INCORPORATED

发明人： Hirata,Hideyuki ,  Watanabe,Soichi

IPC分类号： H01R23/70 ,  H01R13/648

CPC分类号： H05K5/0291 ,  H01R12/57 ,  H01R12/707 ,  H01R12/716 ,  H01R13/648 ,  H01R2201/06 ,  H05K5/0295

摘要： Disclosed is an improved card connector (1) comprising a shell assembly (2) and a pin connector assembly (3). The pin connector assembly includes an insulating housing mounting a upper and lower rows of signal terminals (19) and an upper and lower grounding terminal (27). The signal terminals include connection pins (20) are arranged in upper and lower rows and solder tails for connecting to an underlying printed circuit board. The upper grounding terminal (27) includes a downwardly extending rear wall (27b) having window apertures (27c) formed therein. The connection pins (20) pass through the window apertures (27c) without contacting the grounding terminal to and terminate at solder tails (21). The upper and lower grounding terminals are electrically coupled , and a single row of DIP-type solder tails extending from the lower grounding terminals can be soldered to selected conductors on a printed circuit board to couple both of the grounding terminals to a ground circuit of the printed circuit board.

摘要翻译： 公开了一种包括外壳组件（2）和销连接器组件（3）的改进的卡连接器（1）。 插头连接器组件包括安装上排和下排信号端子（19）以及上下接地端子（27）的绝缘壳体。 信号端子包括排列成上行和下排的连接引脚（20）和用于连接到下面的印刷电路板的焊接引线。 上接地端子（27）包括具有形成在其中的窗孔（27c）的向下延伸的后壁（27b）。 连接销（20）穿过窗孔（27c）而不接触接地端子并终止于焊接尾部（21）。 上部和下部接地端子电耦合，并且从下部接地端子延伸的单排DIP型焊接尾部可以焊接到印刷电路板上的选定导体，以将两个接地端子耦合到 印刷电路板。

公开(公告)号：EP0908977A2

公开(公告)日：1999-04-14

申请号：EP98118961.6

申请日：1998-10-07

申请人： MOLEX INCORPORATED

发明人： Hirata,Hideyuki ,  Watanabe,Soichi

IPC分类号： H01R23/70 ,  H01R13/648

CPC分类号： H05K5/0291 ,  H01R12/57 ,  H01R12/707 ,  H01R12/716 ,  H01R13/648 ,  H01R2201/06 ,  H05K5/0295

摘要： Disclosed is an improved card connector (1) comprising a shell assembly (2) and a pin connector assembly (3). The pin connector assembly includes an insulating housing mounting a upper and lower rows of signal terminals (19) and an upper and lower grounding terminal (27). The signal terminals include connection pins (20) are arranged in upper and lower rows and solder tails for connecting to an underlying printed circuit board. The upper grounding terminal (27) includes a downwardly extending rear wall (27b) having window apertures (27c) formed therein. The connection pins (20) pass through the window apertures (27c) without contacting the grounding terminal to and terminate at solder tails (21). The upper and lower grounding terminals are electrically coupled , and a single row of DIP-type solder tails extending from the lower grounding terminals can be soldered to selected conductors on a printed circuit board to couple both of the grounding terminals to a ground circuit of the printed circuit board.

摘要翻译： 公开了一种改进的卡连接器（1），其包括壳体组件（2）和销连接器组件（3）。 针连接器组件包括安装上下排的信号端子（19）和上下接地端子（27）的绝缘壳体。 信号端子包括连接销（20），其布置在上排和下排以及用于连接到底层印刷电路板的焊尾。 上接地端子（27）包括具有形成在其中的窗孔（27c）的向下延伸的后壁（27b）。 连接销（20）穿过窗孔（27c），而不接触接地端子并终止于焊尾（21）。 上接地端子和下接地端子电耦合，并且从下接地端子延伸的单排DIP型焊尾可以焊接到印刷电路板上的选定导体，以将两个接地端子耦合到接地端子的接地电路 印刷电路板。