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公开(公告)号：EP2770516A4
公开(公告)日：2015-10-07
申请号：EP12841190
申请日：2012-07-16
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2.发明公开
公开(公告)号：EP2822007A4
公开(公告)日：2015-10-28
申请号：EP12870258
申请日：2012-11-15
发明人： ICHIKAWA TOMOMICHI , YOSHIKAWA NORIHIRO , KOBAYASHI SHINICHI , HIOKI YASUNORI , NAKASO ICHIRO , INAKURA TOMOKI
IPC分类号： H01G4/18 , C08G18/40 , C08G18/48 , C08G18/58 , C08G18/62 , C08G18/72 , C08G18/76 , C08G18/79 , C08G18/80 , C08L61/28 , C08L63/00 , C08L71/10
CPC分类号： H01G4/18 , C08G18/4063 , C08G18/58 , C08G18/6212 , C08G18/721 , C08G18/7671 , C08G18/797 , C08G18/8029 , C08G2650/56 , C08L61/28 , C08L63/00 , C08L71/00 , C08L71/10 , H01G4/32 , H01G4/33
摘要： Provided is a dielectric resin composition for a film capacitor having a low dielectric loss. A resin composition constituting dielectric resin films (3, 4) of a film capacitor (1) includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability, and the resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.
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3.发明公开DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR, PROCESS FOR PRODUCING SAME, AND FILM CAPACITOR 审中-公开介质树脂组合物薄膜电容器，及其制造方法薄膜电容器THEREOF
公开(公告)号：EP2404945A4
公开(公告)日：2013-01-23
申请号：EP10748764
申请日：2010-03-03
发明人： HIOKI YASUNORI , ICHIKAWA TOMOMICHI , YOSHIKAWA NORIHIRO , NAKAMURA ICHIRO , NAKASO ICHIRO , KOBAYASHI SHINICHI , INAKURA TOMOKI
CPC分类号： C08G18/6212 , C09D175/04 , H01G4/18 , H01G4/30
摘要： To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of carbon atom repetitions of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a material of dielectric resin films (3, 4) arranged between first and second counter electrodes (5, 6) facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied in such a manner that a pressure applied to the polyvinyl acetal is 50 MPa or more when the first organic material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130°C or higher and a breakdown voltage of 350 V/µm or more,
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