摘要:
A bondwire transition arrangement for interconnecting a signal port (12) on one IC (10) of a multichip module with a signal port (13) on another, adjacent, IC (11) of the same module employs a distributed signal-transition process in which the signal on one port (12) appears as subsignals at tapping points along a series transmission-line segment arrangement (30) between that port and ground (33) on the same IC (10) and the subsignals are recombined along a second series transmission-line segment arrangement (31) connected between the other port (13) and ground (34) on the other IC (11). Spatially corresponding tapping points are interconnected via bondwires (35).
摘要:
A multicell amplifier comprises a first divider unit (40), which receives the input signal of the amplifier, divides it into 2N subsignals, amplifies them and recombines the amplified signals in two N-way combiners to form two local output signals; two further divider units (41, 42), which take the local output signals and divide them into 4N subsignals, amplify them and recombine the amplified signals to form three local output signals; and two combiner units (43, 44), which take the three local output signals and divide them into 4N subsignals, amplify them and recombine the amplified signals to provide the output signal of the amplifier.
摘要:
Die Erfindung betrifft einen integrierten Halbleitermischer mit einem Substrat (10), einem auf dem Substrat (10) angeordneten Radiofrequenz-Balun (12), einem auf dem Substrat (10) angeordneten Lokaloszillator-Balun (14), einem auf dem Substrat (10) angeordneten Zwischenfrequenzport (16), und einer auf dem Substrat (10) angeordneten Mischerdiodenanordnung (18), die mit dem Radiofrequenz-Balun (12), dem Lokaloszillator-Balun (14) und dem Zwischenfrequenzport (16) kommuniziert, wobei der Radiofrequenz-Balun (12) gegen den Lokaloszillator-Balun (14) mittels Durchkontaktierungen (20) abgeschirmt ist.