专利检索 ap:("Matsushita Electronics Corporation") AND inv:"KITAYAMA, Yoshifumi, Matsushita Elec. Ind. Co. Ltd" 第 1 页

1.

发明授权
COMPONENT AFFIXING METHOD AND APPARATUS 有权
标题翻译：组分混溶方法和装置

公开(公告)号：EP1125316B1

公开(公告)日：2005-07-13

申请号：EP99947948.8

申请日：1999-10-18

申请人： Matsushita Electronics Corporation

发明人： MATSUMURA, Nobuya, Matsushita Elec. Ind. Co. Ltd. , SATO, Shoji, Matsushita Elec. Ind. Co. Ltd. , YAMAMOTO, Akihiro, Matsushita Elec. Ind. Co. Ltd. , KITAYAMA, Yoshifumi, Matsushita Elec. Ind. Co. Ltd , NAKAMURA, Yoichi, Matsushita Elec. Ind. Co. Ltd

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 , Y10T29/49128 , Y10T29/5193 , Y10T156/1734

摘要： The component (2) is first brought into point or line contact with the sheet (3) so as to avoid entrapment of air therebetween. The contact area between the component and the sheet is then gradually spread until the entire bottom surface of the component is adhered to the sheet.

摘要翻译： 首先使部件（2）与片材（3）点接触或线接触，以避免其间夹带空气。然后，部件和片材之间的接触面积逐渐扩展，直到部件的整个底面粘附到片材上。