专利检索 ap:("Micron Technology, Inc.") AND inv:"MA, Bingli" 第 1 页

1.

发明公开
INTEGRATED ASSEMBLIES HAVING BARRIER MATERIAL BETWEEN SILICON-CONTAINING MATERIAL AND ANOTHER MATERIAL REACTIVE WITH SILICON 审中-公开

公开(公告)号：EP4035204A1

公开(公告)日：2022-08-03

申请号：EP20868638.6

申请日：2020-07-27

申请人： Micron Technology, Inc.

发明人： DATTA, Devesh, Kumar , DAYCOCK, David , CHOW, Keen, Wah , GEORGE, Tom , DORHOUT, Justin, B. , MA, Bingli , KLEIN, Rita, J. , MELDRIM, John, Mark

IPC分类号： H01L21/768 , H01L27/11524 , H01L27/11556 , H01L27/11548 , H01L27/1157 , H01L27/11582 , H01L27/11575