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公开(公告)号：EP4034934A1
公开(公告)日：2022-08-03
申请号：EP20735808.6
申请日：2020-06-17
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公开(公告)号：EP4028820A1
公开(公告)日：2022-07-20
申请号：EP20760630.2
申请日：2020-06-03
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公开(公告)号：EP3105615B1
公开(公告)日：2019-10-16
申请号：EP15709375.8
申请日：2015-02-04
发明人： MASALKAR, Prafulla , DEPUE, Marshall T. , ZHU, Zhaoming , CANUMALLA, Sridhar , FILER, Eric Paul , KENT, Blair Madison , MENSONIDES, John W.
IPC分类号： G01S7/481 , H04N13/254 , H04N13/296 , G01S17/89
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公开(公告)号：EP4004629A1
公开(公告)日：2022-06-01
申请号：EP20750456.4
申请日：2020-06-08
发明人： TOLENO, Brian J. , STANLEY, Gavin D. , HEIRICH, Douglas L. , LIN, Tzu-Yuan , CANUMALLA, Sridhar
IPC分类号： G02B27/01
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公开(公告)号：EP3105615A2
公开(公告)日：2016-12-21
申请号：EP15709375.8
申请日：2015-02-04
发明人： MASALKAR, Prafulla , DEPUE, Marshall T. , ZHU, Zhaoming , CANUMALLA, Sridhar , FILER, Eric Paul , KENT, Blair Madison , MENSONIDES, John W.
IPC分类号： G01S17/89
CPC分类号： H04N13/254 , G01S7/481 , G01S17/89 , H04N5/2254 , H04N13/296
摘要： Various embodiments relating to a time-of-flight (TOF) depth camera including a vertical-cavity surface emitting laser (VCSEL) array device are disclosed. In one embodiment, a TOF depth camera includes a heat sink having a mounting surface, an illumination module mounted to the mounting surface, and an image sensor mounted to the mounting surface. The illumination module includes a printed circuit board (PCB), a VCSEL array device configured to generate illumination light to illuminate an image environment, and a driver configured to deliver an operating current to the VCSEL array device. The VCSEL array device and the driver are mounted to the PCB. The image sensor is configured to detect at least a portion of illumination light reflected from the image environment.
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公开(公告)号：EP3161912A1
公开(公告)日：2017-05-03
申请号：EP15734011.8
申请日：2015-06-25
发明人： CANUMALLA, Sridhar , SHAH, Ketan R.
CPC分类号： H01S5/02476 , G01B11/22 , H01L33/642 , H01S5/022 , H01S5/02248 , H01S5/02469 , H01S5/4031 , H04N5/2251 , H04N5/2256
摘要： Various implementations relating to an illumination package including an edge-emitting laser diode (EELD) are disclosed. In one embodiment, an illumination package includes a heat spreader including a base and a stub that extends from the base, an EELD configured to generate illumination light, the EELD being mounted to a side surface of the stub, and a substrate coupled to the base at a location spaced from the EELD, the substrate being electrically connected to the EELD.
摘要翻译： 公开了涉及包括边缘发射激光二极管（EELD）的照明封装的各种实现。 在一个实施例中，照明封装包括散热器，该散热器包括基座和从基座延伸的短截线，被配置为产生照明光的EELD，被安装到短截线的侧表面的EELD以及耦合到基座 在与EELD隔开的位置处，衬底电连接到EELD。
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公开(公告)号：EP2951897B1
公开(公告)日：2016-04-27
申请号：EP14705632.9
申请日：2014-01-29
CPC分类号： H01S5/024 , H01L21/82 , H01S5/02212 , H01S5/02248 , H01S5/02407 , H01S5/02438 , H01S5/02469 , H01S5/06226 , H01S5/40
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8.发明公开
公开(公告)号：EP4028854A1
公开(公告)日：2022-07-20
申请号：EP20736876.2
申请日：2020-06-18
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公开(公告)号：EP3999934A1
公开(公告)日：2022-05-25
申请号：EP20730907.1
申请日：2020-05-18
发明人： STANLEY, Gavin, Donald , GONDIPALLI, Sravan, Kumar, Reddy , HEIRICH, Douglas, Lea , CANUMALLA, Sridhar , LUNARDHI, Alfonsus, Dibianto , LINK, John, Michael
IPC分类号： G06F1/20 , G06F1/3203 , G02B27/01
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公开(公告)号：EP3161912B1
公开(公告)日：2020-02-19
申请号：EP15734011.8
申请日：2015-06-25
发明人： CANUMALLA, Sridhar , SHAH, Ketan R.
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