公开(公告)号：EP1083589A2

公开(公告)日：2001-03-14

申请号：EP00119294.7

申请日：2000-09-06

申请人： Mimasu Semiconductor Industry Company Limited

发明人： Tsuchiya, Masato, c/o Mimasu Semiconductor Indust. ,  Ogasawara, Shunichi, c/o Mimasu Semiconductor ,  Murooka, Hideyuki, c/o Mimasu Semiconductor

IPC分类号： H01L21/00

CPC分类号： H01L21/6715 ,  H01L21/6838 ,  Y10S134/902

摘要： Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

摘要翻译： 提供一种晶片旋转保持装置，其通过简单且易于制造的机构在旋转盘的上表面上产生减压，而不需要任何真空源装置，压缩空气供应装置， 压缩气体供给装置等使用中的装置; 可以在不与其后表面接触的同时旋转晶片; 可以容易地调节减压度，并且即使在没有变形的同时旋转的同时也能够保持薄的晶片（厚度为0.1mm以下） 并且具有弯曲的晶片可以在没有弯曲的校正的同时旋转的同时保持。 晶片旋转保持装置包括：旋转盘，其上形成有流体流路; 形成在旋转盘的中心部的通孔; 以及设置在旋转盘的上表面上的多个晶片托架。

公开(公告)号：EP1083589A3

公开(公告)日：2006-03-01

申请号：EP00119294.7

申请日：2000-09-06

申请人： Mimasu Semiconductor Industry Company Limited

发明人： Tsuchiya, Masato, c/o Mimasu Semiconductor Indust. ,  Ogasawara, Shunichi, c/o Mimasu Semiconductor ,  Murooka, Hideyuki, c/o Mimasu Semiconductor

IPC分类号： H01L21/00

CPC分类号： H01L21/6715 ,  H01L21/6838 ,  Y10S134/902

摘要： Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

摘要翻译： 提供一种晶片旋转保持装置，其通过简单且易于制造的机构在旋转盘的上表面上产生减压，而不需要任何真空源装置，压缩空气供应装置， 压缩气体供给装置等使用中的装置; 可以在不与其后表面接触的同时旋转晶片; 可以容易地调节减压度，并且即使在没有变形的同时旋转的同时也能够保持薄的晶片（厚度为0.1mm以下） 并且具有弯曲的晶片可以在没有弯曲的校正的同时旋转的同时保持。 晶片旋转保持装置包括：旋转盘，其上形成有流体流路; 形成在旋转盘的中心部的通孔; 以及设置在旋转盘的上表面上的多个晶片托架。