专利检索 ap:("Mitsubishi Engineering-Plastics Corporation") AND inv:"SUGIYAMA Masahide" 第 1 页

1.

发明授权
COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE WITH PLATING LAYER 有权

公开(公告)号：EP3162915B1

公开(公告)日：2019-02-13

申请号：EP15814582.1

申请日：2015-06-26

申请人： Mitsubishi Engineering-Plastics Corporation

发明人： SUGIYAMA Masahide , YAMADA Ryusuke , KIKUCHI Tatsuya , YAMANAKA Yasushi

IPC分类号： C23C18/20 , C08L101/12 , H05K3/18

2.

发明公开
COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE HAVING PLATING LAYER 审中-公开

公开(公告)号：EP3396019A1

公开(公告)日：2018-10-31

申请号：EP16878351.2

申请日：2016-12-06

申请人： Mitsubishi Engineering-Plastics Corporation

发明人： SUGIYAMA Masahide , KIKUCHI Tatsuya , YAMANAKA Yasushi

IPC分类号： C23C18/20 , C08J7/00 , C08J7/04 , C08K3/22 , C08K3/30 , C08K5/521 , C08K5/5399 , C08L67/00 , C08L69/00 , C08L77/00 , C08L101/00 , C23C18/16

CPC分类号： C23C18/1667 , C08J7/00 , C08J7/04 , C08K3/04 , C08K3/22 , C08K3/2279 , C08K3/30 , C08K5/0066 , C08K5/521 , C08K5/5399 , C08K2003/2248 , C08K2003/2251 , C08L67/00 , C08L69/00 , C08L77/00 , C08L101/00 , C23C18/16 , C23C18/20 , C23C18/285

摘要： To form a plated layer on a surface of the resin molded article without adding the LDS additive to the thermoplastic resin composition. The laser direct structuring layer-forming composition contains a curable compound, an organic solvent, and a laser direct structuring additive.