METHOD FOR PRODUCING LCP FILM FOR CIRCUIT BOARDS, AND LCP FILM FOR CIRCUIT BOARDS MELT EXTRUDED FROM T-DIE

    公开(公告)号:EP4455210A1

    公开(公告)日:2024-10-30

    申请号:EP24175339.1

    申请日:2020-11-20

    摘要: An LCP film for a circuit substrate having a low coefficient of linear thermal expansion and excellent dimensional stability, without excessively impairing excellent basic performance possessed by the liquid crystal polyester, such as mechanical characteristics, electrical characteristics, and heat resistance. A method for manufacturing such an LCP film may comprises: a composition provision step of providing an LCP resin composition at least containing 100 parts by mass of a liquid crystal polyester and 1 to 20 parts by mass of a polyarylate; a film forming step; and a pressurizing and heating step of subjecting the T-die melt-extruded LCP film to pressure and heat treatment to obtain an LCP film for a circuit substrate having a coefficient of linear thermal expansion (α2) in the TD direction of 16.8 + 12 ppm/K.

    THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE

    公开(公告)号:EP4455208A1

    公开(公告)日:2024-10-30

    申请号:EP22911157.0

    申请日:2022-12-19

    摘要: Provided is a thermoplastic polyester resin composition containing 100 parts by weight of a thermoplastic polyester resin (A), 0.1 to 10 parts by weight of a compound (B) having in each molecule 2 or more functional groups capable of reacting with a carboxy group, and 0.1 to 25 parts by weight of a carbon-based nanofiller (C), in which a content of a metal component in the resin composition is 1,000 ppm or less. A polyester resin composition that can provide a molded article that has high electromagnetic wave absorbing properties, excellent mechanical strength, and excellent hydrolysis resistance is obtained.