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公开(公告)号：EP3276046A1
公开(公告)日：2018-01-31
申请号：EP16768889.4
申请日：2016-03-24
发明人： WATANABE Mami , NAKAYA Kiyotaka
CPC分类号： C25D3/32 , C25D3/60 , C25D7/12 , H01L24/11 , H01L24/13 , H01L2224/11462 , H01L2224/13111 , H05K3/188 , H05K3/4007
摘要： A plating solution including (A) a soluble salt containing at least a stannous salt; (B) an acid selected from organic acid and inorganic acid or a salt thereof; and (C) an additive containing a specific ammonium salt is provided.
摘要翻译： 一种电镀液，其包含（A）至少含有亚锡盐的可溶性盐; （B）选自有机酸和无机酸或其盐的酸; 和（C）提供含有特定铵盐的添加剂。
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公开(公告)号：EP3276045B1
公开(公告)日：2019-10-09
申请号：EP16768886.0
申请日：2016-03-24
发明人： NAKAYA Kiyotaka , WATANABE Mami
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3.发明公开
公开(公告)号：EP3770305A1
公开(公告)日：2021-01-27
申请号：EP19772301.8
申请日：2019-03-19
发明人： WATANABE Mami , SUSUKI Kyoka , NAKAYA Kiyotaka
摘要： This tin or tin-alloy plating liquid contains (A) a soluble salt including at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) an additive, wherein the surfactant is a compound (C1) represented by Formula (1) and/or a compound (C2) represented by Formula (2).
In Formulas (1) and (2), R is an alkyl group having 7 to 13 carbon atoms, m is 5 to 11, n is 1 to 3, and m and n are different from each other.-
公开(公告)号：EP3276047B1
公开(公告)日：2019-11-20
申请号：EP16768900.9
申请日：2016-03-24
发明人： NAKAYA Kiyotaka , WATANABE Mami
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公开(公告)号：EP3702493A1
公开(公告)日：2020-09-02
申请号：EP18871709.4
申请日：2018-10-23
发明人： WATANABE Mami , SUSUKI Kyoka , NAKAYA Kiyotaka
摘要： A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent.
Here, in the Formula (1), X is C a H 2a (a is 1 or 3) and m is 2 to 12.-
公开(公告)号：EP3276047A1
公开(公告)日：2018-01-31
申请号：EP16768900.9
申请日：2016-03-24
发明人： NAKAYA Kiyotaka , WATANABE Mami
摘要： A plating solution including (A) a soluble salt containing at least a stannous salt; (B) an acid selected from organic acid and inorganic acid or a salt thereof; and (C) an additive containing sulfonium salt with one or more of aromatic rings is provided.
摘要翻译： 一种电镀液，其包含（A）至少含有亚锡盐的可溶性盐; （B）选自有机酸和无机酸或其盐的酸; 和（C）含有锍盐和一个或多个芳环的添加剂。
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公开(公告)号：EP3715508A1
公开(公告)日：2020-09-30
申请号：EP18871180.8
申请日：2018-10-23
发明人： WATANABE Mami , SUSUKI Kyoka , NAKAYA Kiyotaka
摘要： A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is C a H2 a+1 (where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p + q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.
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公开(公告)号：EP3276045A1
公开(公告)日：2018-01-31
申请号：EP16768886.0
申请日：2016-03-24
发明人： NAKAYA Kiyotaka , WATANABE Mami
CPC分类号： C25D3/32 , C07F9/5442 , C25B11/0494 , C25D3/60
摘要： A plating solution including (A) a soluble salt containing at least a stannous salt; (B) an acid selected from organic acid and inorganic acid or a salt thereof; and (C) an additive containing phosphonium salt with two or more of aromatic rings is provided.
摘要翻译： 一种电镀液，其包含（A）至少含有亚锡盐的可溶性盐; （B）选自有机酸和无机酸或其盐的酸; 和（C）含有具有两个或更多个芳环的鏻盐的添加剂。
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