摘要:
An acrylic resin composition which comprises 100 parts by mass of a rubber-containing multi-stage polymer (I) and 0-10 parts by mass of a thermoplastic polymer (II) and which satisfies: (1) a molded object of the acrylic resin composition has a modulus in flexure, measured at a temperature of 23ºC and a testing speed of 2 mm/min in accordance with ISO 178, of 400 MPa or lower, (2) in an examination with a dynamic viscoelasticity measurement device in the tensile mode, the acrylic resin composition, in the temperature range of 80ºC and higher, shows a peak at 85ºC or higher, and (3) when the acrylic resin composition is extruded at a constant rate (1.57 cm 3 /min) under the conditions of a capillary diameter φ of 1 mm, an L/D of 16, and a temperature of 230ºC and the strand thereof is hauled at a constant rate (10 m/min), then the value of melt tension is 0.03 N or more. This acrylic resin composition has high weatherability, flexibility, and heat resistance.
摘要:
This provides an acrylic resin composition which has a high flowability and low melt viscosity and in which continuous fast molding can be carried out over a long period of time without staying in a molding machine, and by which a molded body having a suppressed whitening property without deterioration of the original properties such as appearance and mechanical strength can be obtained; and to provide a molded body thereof. The acrylic resin composition of the present invention is obtained by polymerizing a monomer, which comprises an alkyl methacrylate having an alkyl group with a carbon number of 1 to 4, in a presence of an elastomeric polymer obtained by polymerizing any one kind or two or more kinds selected from alkyl acrylates having an alkyl group with a carbon number of 1 to 8 and alkyl methacrylates having an alkyl group with a carbon number of 1 to 4 with a graft crossing agent; wherein the composition satisfies the predetermined flowability and light transmittance before and after tensile test.
摘要:
Disclosed is a method for imparting an embossed shape to an acrylic resin film by an embossing die at a temperature T[°C] represented by the following formula (1), wherein the storage modulus (E') under a measurement frequency of 0.1 Hz of the acrylic resin film at the temperature T[°C] is 0.20 to 0.36 Mpa and the elongation at break under the following evaluation method is 100% or more:
(T D : heat distortion temperature of acrylic resin film)
Test specimen: film-form material having a thickness of 50 µm and a width of 15 mm Tensile test conditions: initial chuck-to-chuck distance: 50 mm, tensile speed: 500 mm/min, temperature: 23°C; an embossed shape-imparting property, a film handling property and a die-release property being excellent in this method.