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    WIRELESS COMMUNICATION MODULE
    1.
    发明公开
    WIRELESS COMMUNICATION MODULE 审中-公开
    无线通信模块

    公开(公告)号：EP3185361A1

    公开(公告)日：2017-06-28

    申请号：EP15852499.1

    申请日：2015-10-13

    申请人： Murata Manufacturing Co., Ltd.

    发明人： MIZUMUMA, Ryuken ,  SUDO, Kaoru

    IPC分类号： H01Q23/00 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q9/16 ,  H01Q13/08

    摘要： A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer. An end of each of the plurality of signal conductor columns and an end of each of the plurality of ground conductor columns are electrically connected to terminals of a mounting substrate. A wireless communication module in which the antenna pattern, which effectively shields the high-frequency device and operates as an antenna, and a ground conductor can be arranged in a multilayer manner is provided.

    摘要翻译： 接地层设置在电介质衬底内。 作为天线工作的天线图案被设置为比接地层更靠近电介质基板的第一表面。 将高频信号提供给天线图案的高频装置安装在介质基板的与第一表面相反的第二表面上或表面上。 由导电材料制成的多个信号导体列和多个接地导体列从第二表面突出。 每个信号导体列通过设置在电介质基板中或电介质基板上的布线图案连接到高频器件，接地导体列连接到接地层。 多个信号导体列中的每一个的末端和多个接地导体列中的每一个的末端电连接到安装基板的端子。 提供了一种无线通信模块，其中可以以多层方式布置有效地屏蔽高频装置并作为天线操作的天线图案和接地导体。

    ARRAY ANTENNA
    4.
    发明公开
    ARRAY ANTENNA 审中-公开
    阵列天线

    公开(公告)号：EP2919323A1

    公开(公告)日：2015-09-16

    申请号：EP13852406.1

    申请日：2013-10-18

    申请人： Murata Manufacturing Co., Ltd.

    发明人： SUDO, Kaoru ,  NAKAJIMA, Masayuki

    IPC分类号： H01Q21/06 ,  H01Q13/08

    CPC分类号： H01Q9/42 ,  H01Q9/0414 ,  H01Q21/0006 ,  H01Q21/06 ,  H01Q21/065 ,  H01Q21/28

    摘要： In a multilayer substrate (2), eight front-side antenna portions (8) and eight back-side antenna portions (16) are disposed. Front-side radiation elements (9) in the front-side antenna portions (8) and back-side radiation elements (17) in the back-side antenna portions (16) are arranged in a staggered pattern when being vertically projected onto an back side (2B) of the multilayer substrate (2). The front-side radiation elements (9) are disposed on a front side (2A) of the multilayer substrate (2), and a front-side ground layer (10) is formed near the back side (2B) of the multilayer substrate (2). On the other hand, the back-side radiation elements (17) are disposed on the back side (2B) of the multilayer substrate (2), and a back-side ground layer (18) is formed near the front side (2A) of the multilayer substrate (2). The front-side radiation element (9) and the back-side radiation element (17) are disposed so as not to overlap each other when being vertically projected onto the back side (2B) of the multilayer substrate (2).

    摘要翻译： 在多层基板（2）中，配置有8个前侧天线部（8）和8个后侧天线部（16）。 垂直投影到背面上时，前侧天线部分（8）中的前侧辐射元件（9）和后侧天线部分（16）中的后侧辐射元件（17）以交错模式布置 （2）的侧面（2B）。 正面侧放射元件9配置在多层基板2的正面2A上，在多层基板2的背面2B附近形成正面侧接地层10， 2）。 另一方面，在多层基板（2）的背面（2B）上配置背面侧发射元件（17），在背面侧（2A）附近形成背面侧接地层（18） （2）。 当垂直投影到多层基板（2）的背面（2B）上时，正面辐射元件（9）和背面辐射元件（17）被设置为不相互重叠。