STRUCTURE FOR MOUNTING MULTI-FEATURED VIBRATION ACTUATOR ON CIRCUIT BOARD
    1.
    发明公开
    STRUCTURE FOR MOUNTING MULTI-FEATURED VIBRATION ACTUATOR ON CIRCUIT BOARD 审中-公开
    STRUKTUR ZUR MONTAGE EINES MEHRERE MERKMALE AUFWEISENDEN VIBRATIONSANTRIEBS AUF EINER LEITERPLATTE

    公开(公告)号:EP1640074A1

    公开(公告)日:2006-03-29

    申请号:EP04745662.9

    申请日:2004-06-08

    IPC分类号: B06B1/04 H05K1/18

    CPC分类号: H02K33/18 H02K5/225 H05K3/301

    摘要: [Problems] To enable the mounting of a multifunctional vibrating actuator on the surface of a circuit board by solder reflow without exposing the components with poor heat resistance― the diaphragm, magnet, and voice coil―to the high temperatures of the reflow tank.
    [Means For Solving Problems] The structure for mounting a multifunctional vibrating actuator on a circuit board is constituted such that a bracket is fixed to the surface of the circuit board by solder reflow, and then the housing of the multifunctional vibrating actuator is placed in the bracket so that the terminals of the multifunctional vibrating actuator are electrically connected to the electrodes of the circuit board.

    摘要翻译: [问题]为了能够通过回流焊将多功能振动致动器安装在电路板的表面上,而不会使隔膜,磁体和音圈具有较差耐热性的部件暴露于回流槽的高温 。 解决问题的方法将多功能振动促动器安装在电路基板上的结构构成为通过焊料回流将支架固定在电路基板的表面,然后将多功能振动致动器的壳体放置在 使得多功能振动致动器的端子电连接到电路板的电极。