公开(公告)号：EP3126851A1

公开(公告)日：2017-02-08

申请号：EP15713895.9

申请日：2015-04-02

申请人： Feinmetall GmbH

发明人： EKIN, Cetin

IPC分类号： G01R1/04 ,  G01R31/28 ,  G01R1/073 ,  H01R12/71 ,  H01R12/91 ,  H05K3/12 ,  H05K3/46 ,  H05K1/16 ,  H05K1/11 ,  G01R1/067

CPC分类号： G01R1/07371 ,  G01R1/0491 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2889 ,  H01L21/67288 ,  H01R12/714 ,  H01R12/91 ,  H05K1/0296 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/1241 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4664 ,  H05K3/4673 ,  H05K2201/0187 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/0126 ,  H05K2203/159

摘要： The invention relates to a contact-distance transformer (4) of an electrical testing device (1) for testing an electrical test item (7), in particular wafers (8), said contact-distance transformer (4) being suitable for reducing the distance between electrical contacts (16, 19) arranged next to one another, and having a non-electrically conductive carrier structure (28) occupying a first side (17) and a second side (18), wherein first electrical contacts (16) are arranged on the first side (17) at a contact distance (a) to one another, and second electrical contacts (19) are arranged on the second side (18) at a smaller contact distance (b) to one another in relation to the first contacts (16) of the first side (17), wherein the first contacts (16) are connected to the second contacts (19) via electrical connections (20) which are passing through the carrier structure (28) and/or which are arranged on the carrier structure (28). According to the invention, both the carrier structure (28) and the electrical connections (20) are formed as 3D-printed components (27). The invention also relates to an electrical testing device (1), and a method for producing a contact-distance transformer (4).

摘要翻译： 电检测装置的电检体的检测的接触距离变压器：诸如晶片，用于降低邻近电触头之间的距离，具有带有第一侧与第一电接触的非导电性的支撑结构的变压器定位开的 第一距离和与第二电触点的第二侧面定位开的第二，较小的距离。 所述第一触点连接到通过穿过支撑结构和/或其中的电连接的第二触点在所述支撑结构被定位。

公开(公告)号：EP1601016B1

公开(公告)日：2012-04-25

申请号：EP05009074.5

申请日：2005-04-26

申请人： Semikron Elektronik GmbH & Co. KG Patentabteilung

发明人： Steger, Jürgen

IPC分类号： H05K1/14 ,  H01L23/48 ,  H01L25/16

CPC分类号： H01L24/72 ,  H01L25/162 ,  H01L2224/0603 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/144 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10409

公开(公告)号：EP2208405B1

公开(公告)日：2011-05-18

申请号：EP08845428.5

申请日：2008-11-03

申请人： Cinterion Wireless Modules GmbH

发明人： WENDLER, Ralf ,  ROMAHN, Jörg ,  BÖLCKE, Annette

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/325 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09381 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10265

摘要： The invention relates to a configuration, comprising a first circuit board (ELP), which has a contact surface (KF) for contacting a connection element (VE), said contact surface (KF) comprising a central contact point and a concentric ring enclosing said central contact point; a second circuit board (ZLP); and a connection element (VE), which is electrically contacted on a first side with the second circuit board (ZLP) and which comprises a first spring element (FE1) and at least one second spring element (FE2, FE3) on a second side, which is opposite the first side, said first spring element (FE1) being electrically contacted with the central contact point of the first circuit board (ELP) and the at least one second spring element (FE2, FE3) being electrically contacted with the concentric ring of the first circuit board (ELP).

公开(公告)号：EP1959717A4

公开(公告)日：2010-10-06

申请号：EP06833717

申请日：2006-11-30

申请人： IBIDEN CO LTD

发明人： KARIYA TAKASHI ,  FURUTANI TOSHIKI ,  KAWANISHI TAKESHI

IPC分类号： H01R12/50 ,  H05K1/18

CPC分类号： H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

公开(公告)号：EP2073614A3

公开(公告)日：2010-03-10

申请号：EP08254002.2

申请日：2008-12-15

申请人： Hosiden Corporation

发明人： Ohmori, Yasuhiro

IPC分类号： H05K3/30 ,  F21V19/00 ,  H01R33/08

CPC分类号： H05K3/301 ,  F21V19/008 ,  H01H85/202 ,  H01R33/0836 ,  H05K2201/10113 ,  H05K2201/10265 ,  H05K2201/10295 ,  H05K2201/10393

摘要： An object of the present invention is to provide a contact and a connecting device capable of stably connecting and supporting an electronic component such as a cold cathode fluorescent lamp in midair.
A contact 200 for connection with a cold cathode fluorescent lamp 10 includes a base part 210, a supporting part 220 that is provided on top of the base part 210 for supporting a lead terminal 12 of a cold cathode fluorescent lamp 10, and at least two clamp parts 230 that are provided on top of the base part 210 so as to be located on respective outer sides of the supporting part 220. The clamp parts 230 are adapted to sandwich the lead terminal 12 of the lamp 10 between themselves and the supporting part 220. Alternatively, the clamp parts 230 may be adapted to sandwich part of an adapter for the lead terminal.

公开(公告)号：EP1855897A4

公开(公告)日：2009-08-12

申请号：EP05725084

申请日：2005-03-09

申请人： MICHELIN SOC TECH ,  MICHELIN RECH TECH

发明人： SINNETT JAY C ,  SMITH CAMERON E ,  ADAMSON JOHN DAVID

IPC分类号： B60C1/00 ,  B60C23/00 ,  B60C23/04

CPC分类号： B60C23/0493 ,  B60C23/0452 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  Y02P70/613

摘要： A strain-resistant electrical connection and a method of making the same is provided. An antenna (36, 38) or other conductive lead is connected to a circuit (32) in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the antenna (36, 38) or conductive lead relative to the circuit (32). The antenna (36, 38) or conductive lead is at least partially coiled to provide additional ability to withstand mechanical stresses. The antenna (36, 38) or conductive lead may be encase along with is connected circuit in an elastomeric material.

公开(公告)号：EP1864556A2

公开(公告)日：2007-12-12

申请号：EP06722702.5

申请日：2006-03-28

申请人： Conti Temic microelectronic GmbH

发明人： SCHLENKER, Roberto ,  NAGEL, Michael ,  MARTIN, Jürgen

IPC分类号： H05K1/02 ,  H01H37/76

CPC分类号： H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

摘要： The invention relates to an electronic assembly (1) which comprises a printed circuit (2), provided with strip conductors (6) and equipped with a plurality of SMD components (4) and/or additional electronic and/or electromechanical components using a suitable solder, thereby forming an electronic circuit. The aim of the invention is to ensure by simple means that power dissipation of such an electronic assembly is reduced. For this purpose, a plurality of connections is established between strip conductors (6), components and/or component parts via respective spring-loaded contact bridges (12, 12', 12'', 12''').

摘要翻译： 本发明涉及包括印刷电路（2）的电子组件（1），该印刷电路设置有带状导体（6）并且配备有多个SMD部件（4）和/或附加的电子和/或机电部件， 焊料，从而形成电子电路。 本发明的目的是通过简单的手段确保这种电子组件的功率消耗减少。 为此，通过各自的弹簧加载的接触桥（12,12'，12“，12”'）在带状导体（6），部件和/或部件之间建立多个连接。

公开(公告)号：EP1616352A1

公开(公告)日：2006-01-18

申请号：EP04759412.2

申请日：2004-04-12

申请人： Formactor, Inc.

发明人： LINDSEY, Scott, E. ,  MILLER, Charles, A. ,  ROYSTER, David, M. ,  WENZEL, Stuart, W.

IPC分类号： H01L23/485 ,  H01L23/48

CPC分类号： G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

摘要： A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

公开(公告)号：EP3285553A1

公开(公告)日：2018-02-21

申请号：EP16306063.5

申请日：2016-08-17

申请人： Thomson Licensing

发明人： LO HINE TONG, Dominique ,  MORIN, Pierre-Marie ,  LE FOULGOC, Jean-Marc

IPC分类号： H05K1/02 ,  H01P1/12 ,  H05K3/32 ,  H01H1/26 ,  H01H1/58 ,  H01R12/52

CPC分类号： H05K3/325 ,  H01H1/26 ,  H01H1/5822 ,  H01H2001/5811 ,  H01H2221/044 ,  H01H2235/028 ,  H01P1/127 ,  H01P5/028 ,  H01R12/526 ,  H05K1/0242 ,  H05K1/0268 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10765 ,  Y02P70/611

摘要： An interconnection element (255) is described including a first part (405) for connection to a first port of a transmission line (205) and a second flexible part (410) for connection to a second port of the transmission line (210), wherein in a first operating mode the first part is fixed to the first port and the second flexible part is biased such that it contacts the second port to interconnect the first and second port via the interconnection element; and in a second operating mode the first part is fixed to the first port and the second flexible part is forced away (105, 240) against the bias from the second port such that an open circuit is created between the first port and the second port.

摘要翻译： 描述了互连元件（255），其包括用于连接到传输线（205）的第一端口的第一部分（405）和用于连接到传输线（210）的第二端口的第二柔性部分（410）， 其中在第一操作模式中，所述第一部分固定到所述第一端口，并且所述第二柔性部分被偏置，使得其接触所述第二端口以经由所述互连元件互连所述第一和第二端口; 并且在第二操作模式中，第一部分被固定到第一端口并且第二柔性部分被抵抗来自第二端口的偏压而被迫离开（105,240），使得在第一端口和第二端口之间产生开路 。

公开(公告)号：EP2618442A3

公开(公告)日：2018-01-17

申请号：EP12162716.0

申请日：2012-03-30

申请人： Samsung Electronics Co., Ltd.

发明人： Youn, Jae-sub

IPC分类号： H02H9/00 ,  H02H9/04 ,  H02H9/02 ,  H05K1/02

CPC分类号： H05K9/0067 ,  H02H9/00 ,  H02H9/005 ,  H02H9/026 ,  H02H9/041 ,  H02H9/046 ,  H05K1/0259 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10265

摘要： An electronic device (100) includes an exterior portion (110) of a conductive material, a circuit portion (120) including circuit elements, and a protection circuit portion (130) connected between the exterior portion and the circuit portion. The protection circuit portion (130) includes a switching unit (132) to intercept leakage current that flows from the circuit portion and leaks to the exterior portion, and a conversion unit (131) to reduce a voltage level of an electrostatic component that flows through the exterior portion and to transfer the electrostatic component to the switching unit.

摘要翻译： 一种电子装置（100），包括导电材料的外部部分（110），包括电路元件的电路部分（120）以及连接在外部部分和电路部分之间的保护电路部分（130）。 保护电路部（130）包括：切换单元（132），用于拦截从电路部分流出并泄漏到外部的泄漏电流;以及转换单元（131），用于降低流过的静电元件的电压电平 外部部分并且将静电部件转移到切换单元。