公开(公告)号：EP4417400A1

公开(公告)日：2024-08-21

申请号：EP22880906.7

申请日：2022-10-06

Applicant: NHK Spring Co., Ltd.

Inventor： MIZUTA, Hidetoshi ,  FURUSE, Atom ,  NAGASAWA, Kaoru ,  ARAI, Fumitaka

IPC: B29C65/48 ,  B60G21/055 ,  F16B11/00 ,  C09J5/06 ,  C09J201/00 ,  B29C65/02 ,  B29C65/14 ,  B29C65/44 ,  B29C65/46 ,  B29C65/52 ,  B29L31/30 ,  B29L31/00 ,  B29C35/08

CPC classification number: C09J5/06 ,  C09J201/00 ,  B60G21/055 ,  B29C65/4835 ,  B29L2031/305520130101 ,  B29L2031/72120130101 ,  B29C65/44 ,  B29C65/46 ,  B29C66/0242 ,  B29C66/543 ,  B29C66/53241 ,  B29C65/02 ,  B29C66/8322 ,  B29C66/91411 ,  B29C66/944 ,  B29C65/48 ,  B29C66/532 ,  F16B11/006 ,  B29C66/1122 ,  B29C65/522 ,  B29C66/028 ,  B29C66/71 ,  B29C66/7212 ,  B29C66/742 ,  B29C66/73751 ,  B29C66/73753 ,  B29C65/1412 ,  B29C2035/082220130101 ,  B29C65/1416

Abstract: A bonding method according to the present invention is a bonding method for bonding a bush to an adherend member and includes: an adhesive application step of applying an adhesive to a part of a buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.