公开(公告)号：EP1404165A4

公开(公告)日：2007-04-18

申请号：EP02738844

申请日：2002-06-28

Applicant: NITTO DENKO CORP

Inventor： KAWASHIMA TOSHIYUKI ,  TAHARA NOBUHARU ,  IKEDA KENICHI

IPC: H05K3/42 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0116 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/1147 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A method for manufacturing a multilayer wiring board comprises a step of alternately stacking prepreg sheets (1) of a resin porous film impregnated with thermosetting resin and double-sided wiring boards (10) having an insulating layer (11) on both sides of which wiring patterns (12) are formed, and heating and compressing the stack into one piece. The multilayer wiring board is advantageous in mass production because the gap for forming the insulating layer is easily controlled. The whole of the wiring board can be thin, and the planarization of the surface of the wiring board is easy.