公开(公告)号：EP0358063A2

公开(公告)日：1990-03-14

申请号：EP89115742.2

申请日：1989-08-25

申请人： NITTO DENKO CORPORATION

发明人： Kawanishi, Michirou ,  Aizawa, Kaoru ,  Araki, Kyoichi ,  Kamei, Kiyohiro ,  Nagasaki, Kunio

IPC分类号： H05K13/00

CPC分类号： H05K13/0038 ,  B65D73/02

摘要： An electronic component carrier includes an elongated substrate (1) having a series of electronic component-setting portions (2) spaced from one another at a predetermined interval along the length of the substrate (1). The substrate (1) has push bar-insertion holes (3) formed therethrough and disposed respectively at the electronic component-setting portions (2). Adhesive layers (4) are formed respectively on surfaces of the electronic component-setting portions (2). The electronic components (5) are adapted to be bonded respectively to the electronic component-setting portions (2) through the adhesive layers (4). A push bar (P) is adapted to be inserted into the push bar-insertion hole (3) so as to be engaged with the electronic component (5) to release the same from the adhesive layer (4).

摘要翻译： 电子部件载体包括具有一系列电子部件设置部分（2）的细长基板（1），沿着基板（1）的长度以预定间隔彼此间隔开。 基板（1）具有穿过其形成的推杆插入孔（3），分别设置在电子部件设定部（2）。 分别在电子部件设置部分（2）的表面上形成粘合层（4）。 电子部件（5）适于通过粘合剂层（4）分别结合到电子部件固定部（2）。 推杆（P）适于插入到推杆插入孔（3）中，以便与电子部件（5）接合以将其从粘合剂层（4）释放。

公开(公告)号：EP0358063B1

公开(公告)日：1995-02-08

申请号：EP89115742.2

申请日：1989-08-25

申请人： NITTO DENKO CORPORATION

发明人： Kawanishi, Michirou ,  Aizawa, Kaoru ,  Araki, Kyoichi ,  Kamei, Kiyohiro ,  Nagasaki, Kunio

IPC分类号： H05K13/00

CPC分类号： H05K13/0038 ,  B65D73/02

公开(公告)号：EP0358063A3

公开(公告)日：1991-01-30

申请号：EP89115742.2

申请日：1989-08-25

申请人： NITTO DENKO CORPORATION

发明人： Kawanishi, Michirou ,  Aizawa, Kaoru ,  Araki, Kyoichi ,  Kamei, Kiyohiro ,  Nagasaki, Kunio

IPC分类号： H05K13/00

CPC分类号： H05K13/0038 ,  B65D73/02

摘要： An electronic component carrier includes an elongated substrate (1) having a series of electronic component-setting portions (2) spaced from one another at a predetermined interval along the length of the substrate (1). The substrate (1) has push bar-insertion holes (3) formed therethrough and disposed respectively at the electronic component-setting portions (2). Adhesive layers (4) are formed respectively on surfaces of the electronic component-setting portions (2). The electronic components (5) are adapted to be bonded respectively to the electronic component-setting portions (2) through the adhesive layers (4). A push bar (P) is adapted to be inserted into the push bar-insertion hole (3) so as to be engaged with the electronic component (5) to release the same from the adhesive layer (4).