公开(公告)号：EP3859891A1

公开(公告)日：2021-08-04

申请号：EP20154940.9

申请日：2020-01-31

Applicant: NXP B.V.

Inventor： SCHAT, Jan-Peter ,  ZANATI, Abdellatif ,  ASENDORF, Henrik ,  SPELLA, Maristella ,  SYED, Waqas Hassan ,  CARLUCCIO, Giorgio ,  de GRAAUW, Antonius Johannes Matheus

IPC: H01Q3/26 ,  G01S7/03 ,  H01P5/107 ,  H04B17/12 ,  H01L23/66 ,  G01R1/04 ,  G01R31/302

Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

公开(公告)号：EP4343971A1

公开(公告)日：2024-03-27

申请号：EP22197845.5

申请日：2022-09-26

Applicant: NXP B.V.

Inventor： SYED, Waqas Hassan ,  VAN SCHELVEN, Ralph Matthijs ,  CARLUCCIO, Giorgio ,  LOK, Pieter ,  DE GRAAUW, Antonius Johannes Matheus ,  DORIS, Konstantinos ,  NETO, Andrea ,  CAVALLO, Daniele

IPC: H01Q19/06 ,  H01Q1/22

Abstract: In accordance with a first aspect of the present disclosure, an antenna unit is provided, comprising: an integrated circuit package containing an integrated circuit die and an antenna structure coupled to the integrated circuit die; a dielectric layer separated from the integrated circuit package, wherein the dielectric layer is placed at a predefined distance above an upper surface of the integrated circuit package. In accordance with a second aspect of the present disclosure, a corresponding method of producing an antenna unit is conceived.