公开(公告)号：EP3159931A3

公开(公告)日：2017-08-16

申请号：EP16192359.4

申请日：2016-10-05

申请人： NXP USA, Inc.

发明人： Fraser, Michael L ,  Danaher, Frank E ,  Fender, Jason R

IPC分类号： H01L27/02 ,  H01L27/085 ,  H01L21/82 ,  H01P1/15 ,  H03K17/687

CPC分类号： H01L27/085 ,  H01L21/82 ,  H01L27/0207 ,  H01L27/0211 ,  H01P1/15 ,  H03K17/6871

摘要： A monolithic integrated circuit includes first (424) and second (420) pluralities of parallel-connected transistor elements (e.g., transistor fingers). To spread heat in the IC, the first and second pluralities of transistor elements are interleaved with each other and arranged in a first row (474). The IC also may include third (434) and fourth (430) pluralities of parallel-connected transistor elements arranged in a second row (476). The transistor elements in the first row may be series and shunt transistors of an RF switch transmit path, and the transistor elements in the second row may be series and shunt transistors of an RF switch receive path. During a transmit mode of operation, the series transistors in the transmit path and the shunt transistors in the receive path are closed. During a receive mode of operation, the shunt transistors in the transmit path and the series transistors in the receive path are closed.

摘要翻译： 单片集成电路包括第一（424）和第二（420）多个并联连接的晶体管元件（例如，晶体管指状物）。 为了在IC中散热，第一和第二多个晶体管元件彼此交错并排列在第一行（474）中。 IC还可以包括布置在第二行（476）中的第三（434）和第四（430）多个并联连接的晶体管元件。 第一行中的晶体管元件可以是串联和RF开关传输路径的并联晶体管，并且第二行中的晶体管元件可以是串联和RF开关接收路径的并联晶体管。 在发送操作模式期间，发送路径中的串联晶体管和接收路径中的分路晶体管闭合。 在接收操作模式期间，发送路径中的分流晶体管和接收路径中的串联晶体管闭合。

公开(公告)号：EP3159931A2

公开(公告)日：2017-04-26

申请号：EP16192359.4

申请日：2016-10-05

申请人： NXP USA, Inc.

发明人： Fraser, Michael L ,  Danaher, Frank E ,  Fender, Jason R

IPC分类号： H01L27/02 ,  H01L27/085

CPC分类号： H01L27/085 ,  H01L21/82 ,  H01L27/0207 ,  H01L27/0211 ,  H01P1/15 ,  H03K17/6871

摘要： A monolithic integrated circuit includes first (424) and second (420) pluralities of parallel-connected transistor elements (e.g., transistor fingers). To spread heat in the IC, the first and second pluralities of transistor elements are interleaved with each other and arranged in a first row (474). The IC also may include third (434) and fourth (430) pluralities of parallel-connected transistor elements arranged in a second row (476). The transistor elements in the first row may be series and shunt transistors of an RF switch transmit path, and the transistor elements in the second row may be series and shunt transistors of an RF switch receive path. During a transmit mode of operation, the series transistors in the transmit path and the shunt transistors in the receive path are closed. During a receive mode of operation, the shunt transistors in the transmit path and the series transistors in the receive path are closed.

摘要翻译： 一种单片集成电路，包括并联连接的晶体管元件（例如，晶体管的手指）的第一（424）和第二（420）的多个。 在IC扩散热量，晶体管元件的第一和第二多个交错海誓山盟和在第一行（474），其布置。 因此，该IC可包括在第二排（476），其设置并联连接的晶体管元件的第三（434）和第四（430）的多个。 第一行中的晶体管元件可以是串联和RF开关发送路径的分流晶体管，并且所述第二行中的晶体管元件可以是串联和RF开关的分流晶体管接收路径。在操作期间的发射模式，该系列 在发射路径和接收路径中的并联晶体管的晶体管是关闭的。 在操作过程中的接收模式中，在发送路径中的旁路晶体管，并在接收路径中的串联晶体管是关闭的。