公开(公告)号：EP4372021A1

公开(公告)日：2024-05-22

申请号：EP22842045.1

申请日：2022-07-08

申请人： Namics Corporation

发明人： OTSUBO Kodai ,  SUZUKI Fumiya ,  SAKATA Yoko

IPC分类号： C08F290/06 ,  C08G18/67 ,  C08G59/66 ,  C08G75/045 ,  C09J4/02 ,  C09J11/06 ,  C09J163/00 ,  C09J175/14

CPC分类号： C08G18/67 ,  C09J11/06 ,  C09J163/00 ,  C09J4/00 ,  C08G59/66 ,  C09J175/14 ,  C08F290/06 ,  C08G75/045

摘要： The object of the present invention is to provide a curable resin composition that exhibits high curability even when subjected only to heat curing treatment, and that gives, by UV curing treatment and subsequent heat curing treatment, a cured product which has moderate flexibility and elongation, and has improved shock-absorbing capacity compared to cured products provided by conventional UV- and thermo-curable adhesives. The present invention provides a curable resin composition comprising the following components (A) to (E):
(A) an urethane compound containing a (meth)acryloyl group(s),
(B) a (meth)acrylate compound containing no urethane bond,
(C) a polyfunctional thiol compound,
(D) a photo-radical initiator, and
(E) a thermal curing accelerator,
wherein
total number (total amount) of (meth)acryloyl groups for the (A) urethane compound containing a (meth)acryloyl group(s), total number (total amount) of (meth)acryloyl groups for the (B) (meth)acrylate compound containing no urethane bond, and total number (total amount) of thiol groups for the (C) polyfunctional thiol compound satisfy a predetermined relationship.

公开(公告)号：EP4372030A1

公开(公告)日：2024-05-22

申请号：EP22842044.4

申请日：2022-07-08

申请人： Namics Corporation

发明人： OTSUBO Kodai ,  SUZUKI Fumiya ,  SAKATA Yoko

IPC分类号： C08G75/045 ,  C08G59/66 ,  C09J4/02 ,  C09J11/06 ,  C09J163/00

CPC分类号： C09J11/06 ,  C09J163/00 ,  C09J4/00 ,  C08G59/66 ,  C08G75/045

摘要： The object of the present invention is to provide a UV- and thermo-curable resin composition that exhibits sufficiently high adhesive strength when subjected to only either UV-curing treatment or heat-curing treatment. The present invention provides a curable resin composition comprising the following components (A) to (F):
(A) a polyfunctional (meth)acrylate compound,
(B) a monofunctional (meth)acrylate compound with a molecular weight of 400 or less,
(C) an epoxy resin,
(D) a polyfunctional thiol compound,
(E) a photo-radical initiator, and
(F) a thermal curing accelerator,
wherein
total number (total amount) of (meth)acryloyl groups for the (A) polyfunctional (meth)acrylate compound, total number (total amount) of (meth)acryloyl groups for the (B) monofunctional (meth)acrylate compound, total number (total amount) of epoxy groups for the (C) epoxy resin, and total number (total amount) of thiol groups for the (D) polyfunctional thiol compound satisfy a predetermined relationship.