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    CURABLE RESIN COMPOSITION
    1.
    发明公开
    CURABLE RESIN COMPOSITION 审中-实审

    公开(公告)号：EP4372021A1

    公开(公告)日：2024-05-22

    申请号：EP22842045.1

    申请日：2022-07-08

    申请人： Namics Corporation

    发明人： OTSUBO Kodai ,  SUZUKI Fumiya ,  SAKATA Yoko

    IPC分类号： C08F290/06 ,  C08G18/67 ,  C08G59/66 ,  C08G75/045 ,  C09J4/02 ,  C09J11/06 ,  C09J163/00 ,  C09J175/14

    CPC分类号： C08G18/67 ,  C09J11/06 ,  C09J163/00 ,  C09J4/00 ,  C08G59/66 ,  C09J175/14 ,  C08F290/06 ,  C08G75/045

    摘要： The object of the present invention is to provide a curable resin composition that exhibits high curability even when subjected only to heat curing treatment, and that gives, by UV curing treatment and subsequent heat curing treatment, a cured product which has moderate flexibility and elongation, and has improved shock-absorbing capacity compared to cured products provided by conventional UV- and thermo-curable adhesives. The present invention provides a curable resin composition comprising the following components (A) to (E):
    (A) an urethane compound containing a (meth)acryloyl group(s),
    (B) a (meth)acrylate compound containing no urethane bond,
    (C) a polyfunctional thiol compound,
    (D) a photo-radical initiator, and
    (E) a thermal curing accelerator,
    wherein
    total number (total amount) of (meth)acryloyl groups for the (A) urethane compound containing a (meth)acryloyl group(s), total number (total amount) of (meth)acryloyl groups for the (B) (meth)acrylate compound containing no urethane bond, and total number (total amount) of thiol groups for the (C) polyfunctional thiol compound satisfy a predetermined relationship.