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1.发明公开PROCESS FOR PRODUCING RESIN MOLDING HAVING MINUTE CAVITIES ON THE SURFACE 失效VERFAHREN ZUM HERSTELLEN VONKUNSTHARZGEGENSTÄNDENMITMIKROHOHLRÄUMENAN DEROBERFLÄCHE
公开(公告)号：EP0834391A1
公开(公告)日：1998-04-08
申请号：EP96907683.5
申请日：1996-03-28
CPC分类号： B29C59/00 , B29C70/64 , B29C2059/023 , B29C2791/001 , H05K3/0023 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796
摘要： The purpose of the present invention is to provide a method which is suitable for roughing the surface of a resin form, particularly a method suitable for certainly roughening the surface of an interlayer insulating resin for a multilayer printed circuit board to be prepared by a "build-up" method.
The process of the present invention comprises molding a mixture comprising chemical-soluble powder formulated in a resin composition, treating the surface layer of thus obtained resin form with a chemical solution that can dissolve the resin to remove the surface layer of the resin and to expose on the surface of the form at least a part of the powder contained in the form, and subsequently treating the surface with a chemical solution that can dissolve the powder to remove the powder exposed on the surface.摘要翻译： 本发明的目的是提供一种适用于对树脂表面进行粗加工的方法，特别是适用于通过“构建”制备的多层印刷电路板的层间绝缘树脂的表面确实粗糙化的方法 -up“方法。 本发明的方法包括将包含配制在树脂组合物中的化学溶解性粉末的混合物成型，用可溶解树脂的化学溶液处理由此获得的树脂形式的表面层以除去树脂的表面层并暴露 在形式的表面上形成包含在该形式中的至少一部分粉末，随后用可溶解粉末的化学溶液处理表面以除去暴露在表面上的粉末。
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公开(公告)号：EP0858472B1
公开(公告)日：2001-06-20
申请号：EP96935493.5
申请日：1996-10-30
IPC分类号： C08G59/42 , G03F7/032 , C08F290/06
CPC分类号： G03F7/038 , C08F290/064 , C08G59/4292 , G03F7/032 , G03F7/0388
摘要： The photosensitive resin composition of the present invention uses, as the characteristic feature, a modified epoxy resin product obtained by reacting a novolak epoxy resin with an unsaturated monocarboxylic acid in an amount of 30 to 70 % by mol per equivalent of the epoxy group in the novolak epoxy resin in the presence of a trivalent organic phosphorus compound as the catalyst; deactivating the catalytic action of the organic phosphorus compound; and then reacting the resulting reaction product with a polycarboxylic acid anhydride in an amount of 10 to 70 % by mol per equivalent of the epoxy group in the starting novolak epoxy resin and the modified epoxy resin product having an epoxy group, an unsaturated group and a carboxyl group at a mol ratio of the epoxy group: the unsaturated group: the carboxyl group in the molecule being 30 SIMILAR 70 : 30 SIMILAR 70 : 10 SIMILAR 70, as the base resin.
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公开(公告)号：EP0858472A1
公开(公告)日：1998-08-19
申请号：EP96935493.0
申请日：1996-10-30
CPC分类号： G03F7/038 , C08F290/064 , C08G59/4292 , G03F7/032 , G03F7/0388
摘要： The photosensitive resin composition of the present invention uses, as the characteristic feature, a modified epoxy resin product obtained by reacting a novolak epoxy resin with an unsaturated monocarboxylic acid in an amount of 30 to 70 % by mol per equivalent of the epoxy group in the novolak epoxy resin in the presence of a trivalent organic phosphorus compound as the catalyst; deactivating the catalytic action of the organic phosphorus compound; and then reacting the resulting reaction product with a polycarboxylic acid anhydride in an amount of 10 to 70 % by mol per equivalent of the epoxy group in the starting novolak epoxy resin and the modified epoxy resin product having an epoxy group, an unsaturated group and a carboxyl group at a mol ratio of the epoxy group: the unsaturated group: the carboxyl group in the molecule being 30∩70 : 30∩70 : 10∩70, as the base resin.
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